Product category:
Communications ICs (Wired)
News Release from: Toshiba Electronics Europe | Subject: DSS9101U SoC
Edited by the Electronicstalk Editorial
Team on 09 October 2007
Process technology aids powerline
communications
The DSS9101U SoC brings new levels of powerline performance to multimedia applications including home media networks, in-building LANs and low and medium voltage powerline access networks.
Toshiba Electronics Europe's (TEE's) process technology and Universal Array system-on-chip (SoC) design platform have played a key role in the development of a next generation 200Mbit/s powerline communications (PLC) IC from DS2 The DSS9101U SoC brings new levels of powerline performance to multimedia applications including home media networks, in-building LANs and low and medium voltage powerline access networks
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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By basing its design on Toshiba's process technology, DS2 has been able to combine high-performance, low-power operation with very high levels of integration for maximum on-board functionality.
The new IC was developed in conjunction with Toshiba's European LSI Design and Engineering Centre (ELDEC) in Dusseldorf.
In order to minimise time from design concept to full production, ELDEC engineers used Toshiba's Universal Array SoC development platform.
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This flexible platform speeds development time and can accommodate design changes at much later stages in the process than conventional methodologies.
During the development of the IC Toshiba's engineers implemented a number of onboard features, including the advanced custom ADCs and DACs that play a key role in helping the DSS9101U to deliver its 200Mbit/s operation.
A high-performance PLL function and a variety of analogue IP blocks from Toshiba's IP library were also integrated within the chip.
Jorge Blasco, President and CEO of DS2, said "From IPTV applications such as room-to-room HD video streaming to retail requirements for powerline adapters, the demand for high-performance powerline chips is growing rapidly".
"The guarantee of quality that comes with a Japanese brand like Toshiba was a critical factor for us".
"The combination of advanced, low-power process technology, local engineering support and a platform that dramatically cut development time were all key factors in selecting Toshiba as a partner in developing the next generation of IC to address this demand".
Armin Derpmanns, General Manager of the System on Chip (SoC) Business Unit at TEE said "Toshiba's advanced IDM business model is perfectly matched to the requirements of fabless chip makers such as DS2".
"Our local ELDEC engineers were well positioned to provide DS2 with the design, implementation, consultancy and project management support they needed, while the technology and design platform allowed DS2 to meet key criteria relating to performance, power, on-board functionality, cost and time to market".
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