Product category:
Communications ICs (Wireless)
News Release from: TSMC
Edited by the Electronicstalk Editorial
Team on 07 April 2006
65nm process comes on stream two months
early
Qualcomm has begun sampling state-of-the-art wireless devices manufactured on TSMC's 65nm process technology.
Qualcomm has begun sampling state-of-the-art wireless devices manufactured on TSMC's 65nm process technology The news comes two months ahead of schedule, and less than a month after the first devices proved their functionality by actually making wireless phone calls
This article was originally published on Electronicstalk on 17 Oct 2005 at 8.00am (UK)
Related stories
X Architecture designs move down to 90nm
Taiwan Semiconductor Manufacturing Company is ready to accept 90nm X Architecture designs.
65nm SoC technology comes on stream
Taiwan Semiconductor Manufacturing Company has successfully completed the first of three CyberShuttle prototype production runs for the company's industry leading 65nm Nexsys technology.
"As the largest fabless semiconductor company and a leader in wireless technology, Qualcomm is committed to driving high levels of integration through advanced process technologies", said Behrooz Abdi, Senior Vice President and General Manager of Qualcomm CDMA Technologies.
"Our close collaboration with TSMC has provided both companies with a faster learning curve, and a faster ramp to production-worthiness".
"The transition to 65nm technology will help bring increased performance and enhanced functionality to our customers' products".
Further reading
Half-node process provides 19% design shrink
Taiwan Semiconductor Manufacturing Company has entered full production of its 80nm "half-node" process technology for high-performance designs.
65nm low power process is ready to roll
Earlier this week, Taiwan Semiconductor Manufacturing Company today told a packed audience at its 2006 Technology Symposium that the company has fully qualified its 65nm low power process technology.
"Qualcomm is one of the first companies to adopt 65nm for volume production", said Dr Kenneth Kin, Senior Vice President of worldwide sales and service of TSMC.
"TSMC has distinguished itself in its ability to be the first in the foundry industry to provide leading-edge technology and manufacturing capacity".
"Through collaboration between Qualcomm and TSMC, we have been able to engage in product design and process technology development in parallel so as to remove design barrier and ramp new technology to volume production fast".
The Qualcomm Mobile Station Modem (MSM) MSM6800 chipset for cdma2000 1xEV-DO Revision A networks, was delivered to Qualcomm earlier this year and initial tests indicated that it would be ready for sampling two full months ahead of schedule.
In October 2005, TSMC announced it had successfully completed its first CyberShuttle prototype production run for the company's 65nm technology.
Five major customers' designs and multiple third-party IP designs were on the shuttle.
Since then, TSMC has launched four more CyberShuttles with many more customers and IP/library partners actively participated.
TSMC's 65nm success builds on the company's industry leading 0.13um and 90nm track records.
TSMC estimates that the 65nm production will ramp during 2006, and the company will also launch 65nm prototyping shuttles every other month, enabling customers and EDA, IP and library suppliers to prototype and qualify their leading-edge designs.
TSMC's 65nm NexsysSM technology is the company's third-generation semiconductor process employing both copper interconnects and low-k dielectrics.
It is a nine-layer metal process with core voltages of 1.0 or 1.2V, and I/O voltages of 1.8, 2.5 or 3.3V.
The new technology offering supports a standard cell gate density twice that of TSMC's 90nm Nexsys process.
It also features very competitive 6T SRAM and 1T embedded DRAM memory cell sizes.
In addition, this technology offering includes mixed signal and radio frequency functionality to support analogue and wireless design, embedded high density memory to support integration of logic and memory and electrical fuse to support customer encryption needs.
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