Product category:
PCB Connectors
News Release from: TTI Europe | Subject: AirMax VS
Edited by the Electronicstalk Editorial
Team on 20 March 2006
Virtual shield boosts backplane
connector speed
AirMax VS connectors feature an innovative design that uses air as a highly efficient dielectric and employs staggered contacts to produce "virtual shields".
TTI Europe is the only distribution company in Europe that can currently supply FCI's AirMax VS (virtual shield) connector system ex-stock The world's leading independent passive component and connector specialist is FCI's "focused partner" for the Airmax range, and believes that the revolutionary high speed backplane connector family is a must-see product for any design engineers currently working on, or looking at, high speed backplane solutions
This article was originally published on Electronicstalk on 30 May 2005 at 8.00am (UK)
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It is the only connector system of its type that allows for any allocation of signals within one connector.
AirMax VS connectors also provide headroom to scale performance, allowing designers to increase datarates from 2.5 to 25Gbit/s without the need to redesign their basic platform.
AirMax VS connectors feature an innovative design that uses air as a highly efficient dielectric and employs staggered contacts to produce "virtual shields", eliminating the need for interleaving metal shields that add cost and weight.
The technology delivers high signal density with superior electrical performance - the industry's lowest insertion loss and lowest crosstalk.
At the heart of this unique design is an insert moulded leadframe assembly (IMLA) that can be used for either differential pair signals, single ended signals or power - all within the same IMLA.
The two-piece connectors are available with 3 or 2mm spacing between adjacent IMLAs.
AirMax VS connectors with 2mm column spacing provide the highest signal density available with 25mm card slot spacing, accommodating up to 63 differential pairs or 95 single ended lines per inch.
Widening the column spacing to 3mm allows system designers to increase the number of traces that can be routed in a PCB layer, enabling up to a 50% reduction in the number of layers in their high-speed backplanes and daughtercards.
The backplane connectors are available in 150 or 120 position (five differential pairs per column) configurations for 25mm slot pitch applications, a 120-position (four differential pairs per column) configuration for 20mm slot pitch applications, or in 90-, 72- or 54-position (three differential pairs per column) configurations for 16.7mm slot pitch applications.
Coplanar interconnects are also available. Request a free brochure from TTI Europe ...
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