Product category:
Communications ICs (Wired)
News Release from: Tundra Semiconductor | Subject: Tundra System Interconnect
Edited by the Electronicstalk Editorial
Team on 25 May 2001
High-performance system interconnect
family
Tundra Semiconductor has unveiled comprehensive new product lines to advance its Tundra System Interconnect strategy.
Tundra Semiconductor has unveiled comprehensive new product lines to advance its Tundra System Interconnect strategy, enabling communications infrastructure equipment vendors in the wireless and wireline industries to bring networking products to market faster, at less cost, and with much higher performance The strategy includes RapidIO, PCI-X and next-generation PowerQUICCll/PowerPC interconnect product lines
This article was originally published on Electronicstalk on 28 May 2001 at 8.00am (UK)
Related stories
PowerPC host bridges minimise CPU-memory latency
The Tundra Semiconductor Tsi85x family of PowerPC host bridges enables communications infrastructure equipment vendors to meet the demands of greater bandwidth and reduced board space.
Reference design supports comms processor on PCI
The Wind River PPMC8260 reference design supports designs using the Tundra PowerSpanTMII multiport PCIbus switch for PowerQUICC II microprocessor architectures.
These products clearly indicate the company's strong commitment to and market dominance in providing high-performance system interconnect.
"These high performance interconnect products will increase the efficiency and capacity of Motorola's Smart Networks Platform", said Daniel Artusi, Corporate Vice President and General Manager of Motorola's Networking and Computing Systems Group.
"This next-generation System Interconnect technology will enable Motorola and Tundra to strengthen our current market positions".
Further reading
Platform to accelerate RapidIO deployment
A new hardware interoperability platform (HIP) motherboard will allow designers to evaluate RapidIO system interconnect devices from Tundra Semiconductor.
RapidIO interfaces hit the ground running
The Tsi400 RapidIO to PCI-X bus bridge and the Tsi500 RapidIO multiport switch are the first commercially available RapidIO system interconnect products.
New name for PowerPC host bridge product line
Tundra Semiconductor has agreed to purchase Motorola's PowerPC host bridge product line (the MPC106 and the MPC107).
Through its alliance with Motorola, announced in October, Tundra and Motorola are creating semiconductor intellectual property blocks that will be used in Motorola processors and Tundra System Interconnect devices.
As a result, Tundra is able to create a rich product set that is tightly aligned with Motorola's Smart Networks Platform.
The Tundra System Interconnect products help vendors address their customers' needs by providing standards-based network equipment that can scale to multi-gigahertz speeds and beyond, and also integrate with existing infrastructure.
Furthermore, the Tundra products enable systems designers to develop scalable RapidIO-based architectures that take full advantage of Motorola's industry leading PowerQUICC ll and PowerPC processor families.
As part of its strategy, Tundra will release RapidIO products that include PowerPC host bridges, PCI-to-RapidIO bridges, and RapidIO Switch Fabrics.
RapidIO is the emerging high-speed interconnect standard for the networking market.
Supported by Motorola and other communications equipment giants such as Nortel Networks, Cisco Systems and Lucent Technologies, RapidIO provides greater bandwidth, lower cost, and faster market delivery for next-generation embedded networking products in comparison with conventional bus protocols.
Tundra has also launched the Tsi850, a PowerPC G3/G4 host bridge containing multiple PCI bus interfaces and a memory controller.
The Tsi850 enhances the current Tundra PowerPC interconnect offering by providing a single chip PowerPC host bridge solution.
The device's software-compatibility with the proven Tundra PowerSpan and PowerPro ensures rapid time-to-market for communications infrastructure equipment vendors.
Tsi850 prototypes will be available in late 2001.
One of the most recent offerings in the Tundra System Interconnect portfolio is PowerSpan ll, the next-generation PowerQUICC ll/PowerPC interconnect connecting processors such as the Motorola MPC8260 PowerQUICC ll and Motorola PowerPC to multiple PCI-bus segments.
Through its revolutionary switching fabric, PowerSpan ll enables designers to eliminate complex custom circuitry, design higher-speed applications, and deploy their systems more quickly.
PowerSpan ll prototypes are expected to be available from Tundra beginning in July 2001.
Production begins in early 2002.
PowerSpan II pricing starts at $40 US in 10K quantities.
In April 2001, Tundra launched the Tsi320TM, the world's first PCI-to-PCI bus bridge with full PCI-X support for the communications market.
With dual-mode support (transparent and non-transparent modes), the Tsi320 improves the way systems are developed by simplifying design and increasing system performance.
Prototypes will be available in July/August 2001, with production scheduled to begin in January 2002.
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