Product category:
Communications ICs (Wired)
News Release from: Tundra Semiconductor
Edited by the Electronicstalk Editorial
Team on 19 August 2002
Motorola licenses Tempe bridge to Tundra
Motorola Computer Group has signed a contractual agreement for Tundra Semiconductor to market, manufacture, sell and support the Tempe PCI-X/VMEbus bridge in the general embedded market.
Motorola Computer Group has signed a contractual agreement for Tundra Semiconductor to market, manufacture, sell and support the Tempe PCI-X/VMEbus bridge in the general embedded market Motorola today reaffirmed its intention to develop products featuring the Tempe ASIC design and other VME Renaissance technologies
This article was originally published on Electronicstalk on 25 May 2001 at 8.00am (UK)
Related stories
High-performance system interconnect family
Tundra Semiconductor has unveiled comprehensive new product lines to advance its Tundra System Interconnect strategy.
PowerPC host bridges minimise CPU-memory latency
The Tundra Semiconductor Tsi85x family of PowerPC host bridges enables communications infrastructure equipment vendors to meet the demands of greater bandwidth and reduced board space.
The Tempe ASIC design is in progress and Motorola expects it will transition from design to sample manufacturing in December 2002.
The innovative Tempe design, based on intellectual property developed by Motorola Computer Group, will implement the 2eSST protocol established as an industry standard by the VMEbus International Trade Association (VITA).
The protocol allows the VMEbus to run at a bandwidth up to 320Mbyte/s.
VMEbus product vendors and end-users will have access to the Tempe chip through a worldwide channel that has been established by Tundra.
In addition to marketing and distributing the product, Tundra will be providing support for the chip in the embedded market and will have the ability to provide future enhancements to the product.
"We have been working with Motorola because of our commitment to the VMEbus and our belief that the market has a long life ahead.
The Tempe chip is a key piece in the VME Renaissance - a period of innovation and performance improvement for VMEbus users.
This technology will help protect OEMs' investments in VME hardware and software and give them a migration path to next-generation architectures", said Rick O'Connor, chief technology officer, Tundra Semiconductor Corp.
"We are not in the business of distributing and supporting stand-alone ASICs, so a key part of building the VME Renaissance ecosystem was to find a suitable technology and distribution partner for this chip - Tundra was the obvious choice", said Dave Barker, product marketing manager, Motorola Computer Group.
"Customers will win as a result of this relationship through access to a proven distribution channel for the chip and a high-level of support from Tundra.
Given the industry's early excitement about the VME Renaissance, we're pleased to have this relationship in place and look forward to working with Tundra to unveil the Tempe chip to the market".
• Tundra Semiconductor: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
