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Product category: Communications ICs (Wired)
News Release from: Tundra Semiconductor | Subject: RapidIO system interconnect devices
Edited by the Electronicstalk Editorial Team on 27 March 2003

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A new hardware interoperability platform (HIP) motherboard will allow designers to evaluate RapidIO system interconnect devices from Tundra Semiconductor.

A new hardware interoperability platform (HIP) motherboard will allow designers to evaluate RapidIO system interconnect devices from Tundra Semiconductor The board is being manufactured and distributed by IneoQuest Technologies, the newest member of the Tundra Third Party Partners Programme

Tundra is the first company to build system interconnect devices for RapidIO.

This significant milestone combined with the commercially available HIP strengthens the leadership position Tundra has achieved in the RapidIO market.

RapidIO technology - supported by communications giants such as Alcatel, Motorola, IBM, Lucent Technologies and Ericsson - delivers the performance required in next-generation systems for both communications and storage companies.

It takes advantage of the characteristics of new process technology to give customers an outsourced interconnect solution that is easy to integrate and shortens time to market.

The HIP is an open, public standard that developers have adopted as their RapidIO interoperability and component-testing platform.

The Tundra's HIP architecture is a key RapidIO enabler that allows legacy hardware and software products to seamlessly integrate with the RapidIO technology.

By bridging current technology with the new RapidIO standard, customers have a cost effective and low risk method to bypass current bandwidth bottlenecks and evolve their systems with RapidIO technology.

The decision to partner with IneoQuest to manufacture and distribute the HIP was based on IneoQuest's extensive experience in the design, manufacture, and distribution of high-speed hardware platforms.

"This partnership with IneoQuest makes strategic business sense.

It gives us a direct channel and gives customers faster time-to-market advantage", said Jim Roche, President and CEO of Tundra.

"Customers want to buy system interconnect from us so that they can focus on their core competencies and leverage our RapidIO expertise.

With the commercial availability of the HIP, we continue to build and strengthen our RapidIO system interconnect offerings".

"Our third party partners - such as IneoQuest Technologies - work closely with us to develop a holistic approach to our RapidIO system interconnect offerings", said Jim Parisien, Product Manager, Third Party Programmes.

"The HIP motherboard is one example of the successful results of our partner programmes".

"IneoQuest Technologies is pleased to have been chosen by Tundra to manufacture and distribute the HIP", said Marc Todd, President and CEO, IneoQuest Technologies.

"This launch marks the beginning of a mutually successful and extensive relationship.

We look forward to the opportunity to collaborate with Tundra as they continue to develop and bring next generation RapidIO products to market".

IneoQuest Technologies is now taking orders for delivery in April 2003.

HIP single-piece pricing in the USA is $2499.

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