Product category:
Communications ICs (Wired)
News Release from: Tundra Semiconductor
Edited by the Electronicstalk Editorial
Team on 30 September 2003
Tundra helps Motorola with system
interconnect
Tundra Semiconductor has signed a multi-million-dollar collaborative agreement with Motorola for the development of next generation PowerPC system interconnect technology.
Tundra Semiconductor has signed a multi-million-dollar collaborative agreement with Motorola for the development of next generation PowerPC system interconnect technology PowerPC technology is based on a high-performance processor bus specification
This article was originally published on Electronicstalk on 25 May 2001 at 8.00am (UK)
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High-performance system interconnect family
Tundra Semiconductor has unveiled comprehensive new product lines to advance its Tundra System Interconnect strategy.
PowerPC host processors are used in designs by leading communications, wireless and storage companies in applications as diverse as Internet routers, wireless base stations, media gateways, storage switches and high-end printers.
"This agreement deepens our relationship with Motorola - a leader in the embedded industry -and strengthens our PowerPC strategy", said Jim Roche, President and CEO of Tundra.
"Tundra continues to drive its PowerPC host bridge product family with the development of this next generation device.
This agreement gives our customers a complete PowerPC system interconnect roadmap".
"There is a trend across our industry where companies outsource their system interconnect requirements in order to focus on their competitive strengths", said Jim Roche.
"As this trend accelerates Tundra is well-positioned as the market leader of outsourced standards-based system interconnect products".
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