Product category:
Communications ICs (Wired)
News Release from: Tundra Semiconductor
Edited by the Electronicstalk Editorial
Team on 05 March 2007
Alliance puts interprocess comms over
RapidIO
Tundra Semiconductor Corp and Enea have collaborated to deliver Enea's Linx interprocess communications (IPC) services over RapidIO.
Tundra Semiconductor Corp and Enea have collaborated to deliver Enea's Linx interprocess communications (IPC) services over RapidIO Working with Tundra's new Serial RapidIO development platforms, Enea has implemented and verified complete support for Linx over RapidIO and interoperability with Tundra's RapidIO switches
This article was originally published on Electronicstalk on 25 May 2001 at 8.00am (UK)
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High-performance system interconnect family
Tundra Semiconductor has unveiled comprehensive new product lines to advance its Tundra System Interconnect strategy.
PowerPC host bridges minimise CPU-memory latency
The Tundra Semiconductor Tsi85x family of PowerPC host bridges enables communications infrastructure equipment vendors to meet the demands of greater bandwidth and reduced board space.
Together, RapidIO and Linx provide a reliable, scalable, high performance interconnect platform for quickly developing and deploying next-generation communications infrastructure systems.
"Network equipment providers require flexible system architectures that can be easily reused across multiple products lines, scaled to meet increased subscriber demand, and upgraded to deliver new services", said Linda Thompson, Vice President of Corporate Alliances at Enea.
"Tundra's best-in-class RapidIO technology, coupled with our Linx IPC services, provide a high performance, high-availability platform for deploying converged IP multimedia services that reduce capital and operating expenses for both equipment makers and service providers".
Further reading
Reference design supports comms processor on PCI
The Wind River PPMC8260 reference design supports designs using the Tundra PowerSpanTMII multiport PCIbus switch for PowerQUICC II microprocessor architectures.
Platform to accelerate RapidIO deployment
A new hardware interoperability platform (HIP) motherboard will allow designers to evaluate RapidIO system interconnect devices from Tundra Semiconductor.
RapidIO interfaces hit the ground running
The Tsi400 RapidIO to PCI-X bus bridge and the Tsi500 RapidIO multiport switch are the first commercially available RapidIO system interconnect products.
"We were thrilled to partner with Enea to bring this technology to the communications infrastructure market", said Daniel Hoste, President and Chief Executive Officer, Tundra Semiconductor.
"RapidIO is the right System Interconnect for high bandwidth communications systems and Enea's Linx over RapidIO will allow our communications customers to deploy new systems to market faster".
"RapidIO is increasingly penetrating new aspects of our customer's and partner's technology and Tundra is meeting the increased demand for its industry-leading expertise, products, and design tools as RapidIO evolves", continued Hoste.
RapidIO is a leading serial interconnect standard for embedded systems, and is ideal for aggregating and connecting large numbers of microprocessors, DSPs and FPGAs, both on a single board, and on multiple boards across a backplane.
Tundra, a founding member of the RapidIO Trade Association and long-time Steering Committee member, was the first semiconductor vendor to bring Serial RapidIO switches to market.
These switches, which include the Tsi578, Tsi576, Tsi574, Tsi568A and Tsi564A, provide high performance chip-to-chip interconnect between RapidIO end-points, and can be used to replace existing proprietary backplane fabrics for board-to-board interconnect.
Enea's Linx provides reliable, high-performance interprocess communications services over physical interconnects like RapidIO.
Using direct message passing, Linx makes complex distributed systems easier to conceptualise, model, partition, and scale.
Linx scales from DSPs and microcontrollers to 64bit CPUs, is independent of the underlying processor and operating system, supports control and data plane applications over reliable and unreliable media, and delivers 20% higher performance than competing IPC solutions.
Linx also supports any distributed system topology, from a single processor on a single board, to large networks with complex cluster topologies deployed on hundreds of processors in a multirack system.
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