Product category:
Communications ICs (Wired)
News Release from: Tundra Semiconductor
Edited by the Electronicstalk Editorial
Team on 17 August 2007
New direction for Tundra
Agreement is a significant first step in executing Tundra's previously announced smart interconnect solutions strategy.
Tundra Semiconductor has signed an agreement to acquire a new product from a leading global solutions and engineering services provider The agreement is a significant first step in executing Tundra's previously announced smart interconnect solutions strategy
This article was originally published on Electronicstalk on 25 May 2001 at 8.00am (UK)
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The Tundra Semiconductor Tsi85x family of PowerPC host bridges enables communications infrastructure equipment vendors to meet the demands of greater bandwidth and reduced board space.
This product represents a new product line and new market opportunity for Tundra.
Based on strong I/O management experience, Tundra intends to use its existing design teams to develop future products in this new product line and in the broader smart interconnect solutions product portfolio.
"We are excited to announce this major milestone today".
"The acquisition of this highly competitive product is a positive step forward for Tundra and strongly positions the Company for future growth", says Daniel Hoste, President and Chief Executive Officer, Tundra Semiconductor.
"Tundra's new product strategy will deliver intelligent interconnect products, to provide our customers with a competitive edge in their system designs where performance depends more and more on the I/O and interconnect architecture solutions", continues Hoste.
Tundra will acquire the product for a total purchase price of US $15.4 million, with payments impacting the next 3 fiscal years.
Tundra expects revenue associated with this product acquisition to begin to impact fiscal year results in 2010 and expects that lifetime revenue will represent approximately 8 to 12 times the total investment cost.
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