Product category:
Communications ICs (Wired)
News Release from: Tundra Semiconductor | Subject: Tundra Tsi381
Edited by the Electronicstalk Editorial
Team on 21 September 2007
PCI Express to PCI bridge offers low
latency
The Tsi381's x1 PCIe Interface enables the bridge to offer throughput of up to 2.5Gbit/s.
Tundra Semiconductor has released the Tundra Tsi381 single-lane PCI Express (PCIe) to PCI bridge Pin compatible with competing PCIe bridge products, this product offers lower latency and better throughput than competitive offerings
This article was originally published on Electronicstalk on 25 May 2001 at 8.00am (UK)
Related stories
High-performance system interconnect family
Tundra Semiconductor has unveiled comprehensive new product lines to advance its Tundra System Interconnect strategy.
PowerPC host bridges minimise CPU-memory latency
The Tundra Semiconductor Tsi85x family of PowerPC host bridges enables communications infrastructure equipment vendors to meet the demands of greater bandwidth and reduced board space.
The Tsi381 is ideal for applications that need to bridge from PCIe to PCI devices.
Its flexibility, high-performance, small footprint, and low power consumption make the Tsi381 ideal for consumer and enterprise applications such as line cards, network interface cards, motherboards, PC adapter cards and option cards, multi-function printers, media centres and digital video recorders.
Benny Chang, Tundra's Chief Technology Officer said "The Tsi381 was designed by our Hyderabad, India and North American engineering teams to compete with and beat PCIe bridges currently in the market, on performance, latency and throughput".
Compliant to the latest PCI Express Base 1.1 specification, the Tsi381's x1 PCIe Interface enables the bridge to offer throughput of up to 2.5Gbit/s.
The device's PCI Interface can operate up to 66MHz and offers designers extensive flexibility by supporting three types of addressing modes: transparent, opaque, and nontransparent.
Transparent mode operation is available for efficient, flow through configurations, while nontransparent bridging allows isolation between the Tsi381's PCIe and PCI domains.
Nontransparent bridging also enables multi-host systems and is used in applications such as intelligent adapter cards.
Opaque mode provides semi-transparent operation for multi-processor configurations and enhanced private device support.
The Tsi381 through its efficient architecture and deep buffering offers low latency and superior system performance.
It provides designers with the ability to maximise performance for a wide range of PCI Express bridging applications.
The Tsi381 is designed to operate at industrial temperature range of -40C to +85C.
Currently sampling in a RoHS compliant, 13 x 13mm BGA package it will be available in both standard and RoHS compliant packaging at full production.
• Tundra Semiconductor: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
