Product category:
Communications ICs (Wireless)
News Release from: Telecis Wireless
Edited by the Electronicstalk Editorial
Team on 14 October 2005
Alliance marries WiMAX chips with
antennas
ArrayComm and Telecis Wireless have signed a joint development agreement to create products for the upcoming WiMAX "e" (mobile) standard.
ArrayComm and Telecis Wireless have signed a joint development agreement to create products for the upcoming WiMAX "e" (mobile) standard ArrayComm is the industry leader in smart antenna technology for wireless access (BWA) systems
This article was originally published on Electronicstalk on 25 Apr 2006 at 8.00am (UK)
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Telecis Wireless is a leading developer of multiprotocol BWA chips.
The agreement enables each company to make optimal use of the other's technology.
Telecis Wireless will support ArrayComm's smart antenna solutions in its multiprotocol WiMAX mobile chip and ArrayComm will design its smart antenna solutions to facilitate enhanced performance of the Telecis chip.
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"Through the combination of our performance leading Rx technologies and the demonstrated nomadic WiMAX capabilities of our current WiMAX 'fixed' chip, Telecis Wireless has enabled the first step toward full wireless broadband mobility".
"Telecis intends to continue its lead in the WiMAX mobile market with low-cost, low-power and best-performance solutions".
"Devices with Telecis technology and the ArrayComm solution will represent the absolute best of breed in terms of performance, with gains exceeding 20dB over other solutions", said Sam Endy, CEO of Telecis Wireless.
"Telecis, with its strong background in advanced signal processing techniques, is an ideal partner for ArrayComm, and their chipset architecture is well suited to implement these powerful features".
"Our objective in this collaboration is to deliver breakthrough competitive performance to WiMAX operators", added Martin Cooper, ArrayComm's Executive Chairman.
"The ultimate benefit will be to consumers, who will experience faster speed at lower cost and, as a result, exciting new services and applications".
Telecis Wireless is currently developing high performance 802.16/WiMAX/MIMO chips targeting terminal devices in the fixed, nomadic and mobile broadband markets.
The company's first chip is 802.16-2004/WiMAX "fixed" compliant and incorporates the company's Rx technologies performance enhancing techniques, enabling indoor fixed service as well as full nomadic portability within a service area.
Evolving to full mobility, Telecis Wireless is also developing a multiprotocol broadband wireless chip combining 802.16e/WiMAX "mobile" and the company's WiFi protocols in a single ASIC.
This chip will allow end users to seamlessly connect to the most appropriate network - anytime and anywhere - and provide a compelling solution for WiMAX operators, user terminal device manufacturers and end users.
ArrayComm has extensively deployed smart antenna and spatial processing technologies throughout the world and will be implementing those same solutions with Telecis to deliver significantly higher coverage quality and datarates for WiMAX client devices.
This joint development agreement will ensure the maximum benefits afforded by smart antenna technology to terminal device manufacturers who build their products with Telecis WiMAX mobile chipsets.
"It is no great revelation to note that the success of WiMAX will depend on the availability of cost-effective services and cost-effective cell coverage", said Peter Jarich, Principal Analyst at Current Analysis.
"Smart antenna technologies have long been praised for their ability to improve wireless coverage and capacity".
"Integrating them with 802.16 solutions has the potential to boost the credibility of WiMAX as a viable, mass-market broadband technology".
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