Product category:
Power Supply ICs and Controllers
News Release from: Texas Instruments (April 2006-) | Subject: TPS62350
Edited by the Electronicstalk Editorial
Team on 03 May 2006
Power conversion chip communicates with
DSPs
A tiny high-performance power conversion IC is designed to work in tandem with processing platforms that use TI's SmartReflex power and performance management technologies.
Texas Instruments has introduced a tiny, high-performance power conversion integrated circuit (IC) to work in tandem with processing platforms that use its SmartReflex power and performance management technologies Designed to extend battery life in 3G phones and other portable electronics, the flexible convertor features a 3.4Mbit/s I2C communications interface and ultrafast transient response from a tiny chip scale package
This article was originally published on Electronicstalk on 4 Apr 2006 at 8.00am (UK)
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TI's TPS62350 synchronous, step-down DC/DC convertor supports up to 800mA over the input voltage range of a single-cell lithium-ion (Li-ion) battery.
The device's integrated I2C communications interface allows it to adjust output voltage between 0.75 and 1.53V, efficiently supporting TI's advanced digital signal processors (DSPs), SmartReflex-technologies-enabled OMAP processors, like TI's OMAP3430 processor, and other processor core power supplies in cellphones, PDAs, digital still cameras.
It also supports handheld computers that use Intel's XScale processors.
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The TPS62350 can operate in a power-save mode at light-load currents, and can be placed in a shutdown mode where the power consumption is reduced to less than 1uA.
The device's serial interface is compatible with fast/standard and high-speed mode I2C specification, which allows data transfer at up to 3.4Mbit/s.
The dynamic voltage scaling feature allows the TPS62350 to adjust voltage levels in 12.5mV steps and seamlessly switch to an efficiency-optimised light power factor mode (PFM), a transient-optimised fast PFM mode or a forced PFM mode.
The TPS62350 is optimised for today's smart phones with SmartReflex power and performance management technologies.
SmartReflex solutions, which leverage TI's deep submicron process geometries, significantly reduce chip-level leakage power dissipation.
The technologies incorporate a broad range of intelligent and adaptive hardware and software technologies that dynamically control voltage, frequency and power based on device activity, modes of operation, and process and temperature variation.
SmartReflex technologies co-ordinate the power consumption and performance of all major system components, including multiple processing cores, hardware accelerators, functional blocks and peripherals.
A library of power management cells enables a granular approach to system partitioning of the portable device's power domains.
Finally, SmartReflex technologies provide an open software framework that enables intelligent co-ordination among lower-level hardware technologies and compatibility with OS-based and third-party power management software.
The TPS62350's chip scale package and 3MHz fixed frequency allows a portable designer to implement low-cost inductors and capacitors, which results in a complete power conversion solution that saves extremely valuable board space.
The TPS62350 is sampling now from TI and its authorised distributors.
Volume production is scheduled for June.
The convertor comes in a 12-pin, 2.2 x 1.4mm chip scale package and a 10-pin, 3 x 3mm QFN package.
Suggested retail pricing is $2.05 in 1000 piece quantities.
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