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Product category: PCB Assembly Equipment and Tools
News Release from: Teknek Manufacturing | Subject: Surface Mount Clean Machine
Edited by the Electronicstalk Editorial Team on 15 October 2007

SMT cleaner avoids production disruption

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The world's most advanced contact cleaning equipment for the surface mount sector will make its debut on the Teknek stand at Productronica 2007.

Teknek's Surface Mount Clean Machine has been designed to be compatible with any SMT production environment world-wide The fully adjustable internal conveyor system allows minimum contact with the board yet allows cleaning up to 3mm from edge

Four elastomer rollers and two rolls of pre-sheeted adhesive film will remove any contaminants down to one micron in size which can affect production throughput.

Integral anti-static facilities prevent recontamination.

Side access allows easy replenishment of adhesive rolls and elastomer rolls, keeping production disruption to a minimum.

Full compliance with the PLC Talk and Listen and SMEMA protocols means that the SMT clean machine can be seamlessly integrated into any surface mount production line.

Double or single-sided board cleaning and a by-pass function allow populated boards to be passed through without damaging components.

The system has an optional, external static monitoring system.

The operator interface allows full control of board width and speed functions in addition to access to staged alarm status messages for board jams.

An optional bar code reader provides automatic identification of boards by part number adjusting the track width accordingly.

Teknek will also be showcasing the CM8 and Fast Pad systems at Productronica 2007.

The CM8 has easy to use software which offers a variety of operations for maximum production flexibility.

A direct motor drive mechanism avoids the need for drive belts or chains to increase reliability and improve speed of operation.

It is capable of cleaning a wide range of substrates and board thicknesses.

Fast Pad is the world's first automatic cleaning station for hand rollers.

Using sheeted adhesive rolls instead of the traditional large flat pad system, the Fast Pad is easy to use, cost-effective and dramatically improves yield.

The process time to clean a substrate can be reduced by up to 50% and the number of repetitive actions required to use the roller are reduced without compromising quality.

The Fast Pad still removes dry unattached particles down to one micron in size from a wide range of substrates including PCBs, SMT boards, LCDs and flat panels.

Designed to complement the Teknek DCR (dust cleaning roller) range of handheld contact cleaning rollers, the Fast Pad system ensures that all the surface area of the sheeted adhesive roll is fully used, reducing waste and costs.

It is available with the new ESD roller and silicon-free filmic adhesive system to comply with clean-room regulations.

Four large diameter elastomer rollers remove unattached particles down to one micron in size and then transfer them to a high-coat-weight, pre-sheeted, reverse-wound adhesive roll.

When the outer layer of the adhesive is covered, contaminants are removed and discarded.

Applications for the CM10 include PCBs, flat panel displays, screen printing, LCDs, lamination, packaging and glass manufacture.

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