Product category:
PCB Connectors
News Release from: Tyco Electronics - Comns Computer Consumer Elctrns | Subject: Z-Pack Max
Edited by the Electronicstalk Editorial
Team on 19 December 2005
Backplane connectors boost speed and
density
The quest for higher signal speed and density in backplane applications has resulted in the new Z-Pack Max connector from Tyco Electronics.
The quest for higher signal speed and density in backplane applications has resulted in the new Z-Pack Max connector from Tyco Electronics Building on its highly successful portfolio of high speed backplane connectors which includes the Z-Pack HS3, Z-Pack HM-Zd and Multigig RT product lines, Tyco Electronics has introduced the Z-Pack Max connector as a cost-effective interconnect for backplane applications where high speed, high density and high performance are needed
This article was originally published on Electronicstalk on 9 Sep 2005 at 8.00am (UK)
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"In listening to our customers we heard the need for a cost effective high-speed product and quickly focused significant resources in responding to that need".
"The result of that effort is the Z-Pack Max product line", states Bob Hnatuck, High-Speed Backplane Connector Product Manager at Tyco Electronics.
"One of our goals is to offer a portfolio of products which provides our customers with options and gives them the flexibility to meet their requirements", Hnatuck continued.
The Z-Pack Max backplane connector system performs at speeds up to 10Gbit/s and beyond for applications including servers, storage devices, switches, routers and similar high-speed signal applications.
To achieve the 10Gbit/s-plus speed, ground contacts are positioned within each connector column and are combined with unique lead frame arrangements within the connector which allow the Z-Pack Max connector to achieve low crosstalk and high throughput performance.
The connector employs a unique shield-less design combined with standard manufacturing processes resulting in a significantly more cost effective solution than traditional shielded connectors.
Dual point contact mating and compliant pin board mounting help ensure high reliability.
Z-Pack Max connectors also meet Telcordia requirements and are RoHS compliant.
In addition to a five-pair version (with 26 pairs per 10mm, or 66 differential pairs per inch), a four-pair version (with 21 pairs per 10mm, or 53 differential pairs per inch) is also available.
These configurations accommodate 25.40mm (five-pair) and 20.32mm (four-pair) card slot spacing.
Planned product extensions include a three-pair version for narrow card pitch applications, right angle pin headers for coplanar applications, vertical receptacles for mezzanine applications and high-speed cable assemblies.
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