Product category:
Plugs and Sockets
News Release from: Tyco Electronics - Comns Computer Consumer Elctrns | Subject: Low profile RJ45 modular jack
Edited by the Electronicstalk Editorial
Team on 19 October 2006
Jack lowers profile for ATCA and AMC I/O
Low profile RJ45 modular jack meets requirements for input/output connectors in Advanced Telecommunications Computer Architecture and Advanced Mezzanine Card standards.
Tyco Electronics has released a new low profile RJ45 modular jack to meet the requirements for input/output (I/O) connectors within the Advanced Telecommunications Computer Architecture (ATCA) and Advanced Mezzanine Card (AMC) standards "The offset from the board is designed to fit an AMC half height module faceplate, with maximum dimensions of 4.20mm above and 7.38mm below the printed circuit board", comments Associate Product Manager, Vince Kane
This article was originally published on Electronicstalk on 9 Sep 2005 at 8.00am (UK)
Related stories
One-piece design for board-to-board RF link
A new low-profile single-connector microminiature RF interconnect aims to meet the growing demand for direct board-to-board connections.
"This new low profile design provides better space utilisation by allowing two half height modules to be packaged in place of a single full height module".
"This doubles the number of I/O connections within the available space".
Tyco Electronics' low profile RJ45 modular jacks are shielded and include panel ground springs for EMI containment.
They are also available in both single port and 1x4 configurations, with and without LEDs, and are designed for Gigabit Ethernet (GigE) performance.
• Tyco Electronics - Comns Computer Consumer Elctrns: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
