Product category:
PCB Assembly Equipment and Tools
News Release from: Universal Instruments | Subject: Automated assembly systems
Edited by the Electronicstalk Editorial
Team on 04 November 2002
Support aids flexible manufacturing
Energy management specialist SatCon Technology has worked with Universal Instruments to complete the integration of a new automated assembly system for future generations of its products.
Power and energy management specialist SatCon Technology Corp, has worked with Universal Instruments to complete the integration of a new automated assembly system for future generations of its products Universal Instruments planned the line and supplied equipment to meet SatCon's manufacturing challenges, as well as provided on-site application engineers and access to process laboratory facilities at its Binghamton, NY, headquarters to complete the project
This article was originally published on Electronicstalk on 17 Jul 2002 at 8.00am (UK)
Related stories
Compact outline for speedy placement machine
New from Universal Instruments, the 4797S HSP high-speed placement machine is the company's newest solution for high-volume, turret-style chip shooting.
Fully modular assembly solution
Universal Instruments has enhanced its GSM platform for surface mount component placement.
"Our manufacturing requirements encompass an unusually large variety of components and component technologies, which demanded diverse expertise to solve", said Gregg Davis, engineering manager at Cambridge, MA, based SatCon.
"Universal's applications engineers were omnipresent throughout the project, from helping to develop the initial specification through planning, implementing, and optimising the line.
The support available made all the difference to our ability to implement a solution that met each of our requirements".
Further reading
Irvine takes on complete SMT line
Universal Instruments has installed a complete line solution for Irvine Electronics.
Software makes the most of placement machine
Universal Instruments has complemented the latest hardware enhancements to its GSM placement platform with new UPS+ control software.
High-speed machine takes on larger boards
Universal Instruments reckons the 4797L HSP Chipshooter is the fastest large-board-capable high-speed machine on the market.
John O'Donnell, Senior Sales Engineer for Universal's North-eastern Region said, "SatCon was well aware of the unusual nature of its requirements and sought a partner who could deliver a turnkey solution.
After a comprehensive customer application review, Universal provided very flexible and accurate machines, full process support, system level design and integration, comprehensive training and locally based field engineering support.
Financial needs were addressed through Universal Capital.
Later in the project it also became necessary to move and reconfigure the line to meet SatCon's changing process requirements, which highlighted the flexibility of the solution we provided".
Satcon Technology is a founding player in the rapidly developing market for fuel cell controls.
Using government and corporate funding, it planned to implement a demonstration facility capable of ramping up to production quantities of fuel cell power management modules.
The challenges SatCon faced included SMT production of complex boards, assembling large heatsinks, hybrid production, COB and flip chip.
Universal Instruments' applications engineers helped SatCon configure a line capable of meeting all these requirements.
Davis explained that after successfully demonstrating its capabilities in fuel cell management, SatCon decided to use its skills to capitalise on opportunities in the microelectronics sector.
"Working with the Universal applications engineers, we were able to define the process and reconfigure the line accordingly.
We were also able to send samples to Universal's Advanced Semiconductor Assembly Division and SMT Laboratory at Binghamton, which analysed processes and recommended optimal equipment configurations including software and inspection features.
We were able to exchange a number of equipment features included in the original configuration, replacing them with different options more suited to the microelectronics application".
As a result, the line was quickly reconfigured and is now capable of surface mount; bare die; and mixed SM/die processes including multiple-die packages, flip chip, BGA, and microBGA.
The line has also successfully built hybrids including using low-force placement for fragile devices such as gallium arsenide MMICs for high-frequency applications.
By adding these new component technologies, SatCon has been able to pursue novel approaches to fuel cell controls that enable extremely high power densities in a highly compact system size.
The automotive industry is driving this type of technology toward a size and weight that allows an electric drive train to compete with combustion engines in horsepower, weight, and manufacturing cost.
The SatCon line comprises a DEK screen printer, Universal Instruments single-beam GSM placement platform and GSMx linear motor platform, a Vitronics Soltec reflow oven, and a Vitronics Soltec wave solder.
Satcon's system design and integration was supported by Universal's System Division using conveyors, diverters, workstations and elevators provided by Universal's Odd Form and Final Assembly Division.
• Universal Instruments: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
