Lead-free soldering paper wins award

Edited by the Electronicstalk editorial team Dec 3, 2002

Dr Anthony Primavera and Michael Meilunas of Universal Instruments and Steven Dunford of Nokia Mobile Phones received the best technical paper award at the IPC's annual meeting last month.

Dr Anthony Primavera and Michael Meilunas of Universal Instruments and Steven Dunford of Nokia Mobile Phones received the best technical paper award at the IPC's annual meeting last month in New Orleans.

The paper, "Microstructural evolution and damage mechanisms in Pb-free solder joints during extended -40 to +125C thermal cycles", was selected based on its timely insight into the effects of long-term thermal mechanical stresses and the attendant failure mechanisms in lead-free (Pb-free) solder interconnections.

The authors presented the award-winning paper along with a companion paper on lead-free soldering during the three-day IPC annual meeting.

They were presented with commemorative plaques at a luncheon award ceremony.

Both Primavera and Meilunas are process research engineers in Universal Instruments' Advanced Process/Surface Mount Technology Laboratory located at the corporation's NY-based headquarters.