Product category:
PCB Assembly Equipment and Tools
News Release from: Universal Instruments
Edited by the Electronicstalk Editorial
Team on 24 July 2003
Research to focus on lead-free processes
Universal Instruments and the University of Maryland are to co-operate on research projects into reliability and manufacturability in packaging and assembly.
Universal Instruments Surface Mount Technology Laboratories and the CALCE Electronic Products and Systems Center (EPSC) at the University of Maryland are to co-operate on research projects into reliability and manufacturability in packaging and assembly Work is expected to focus on interconnect reliability and techniques for lead-free manufacturing
This article was originally published on Electronicstalk on 17 Jul 2002 at 8.00am (UK)
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"We are looking to make best use of the total research dollars available in this field", explained George Westby of Universal Instruments' SMT Laboratory.
"By combining our knowledge with CALCE's research, particularly in the fields of modelling and simulation techniques, we expect to make new solutions available to our customers faster, and at lower total cost".
Dr Michael Osterman of CALCE said, "Co-operating with Universal will allow us access to a sizable database of test results, which will help us provide further verification and refinement to simulation techniques that aim to model the lifecycle of any given electronic assembly based on its anticipated use environment.
This knowledge is valuable to our research clients, including OEMs requiring solutions to physical design, supply chain and services assessment, thermal management and reliability assessment".
Universal expects the results of the co-operation to be particularly important to its manufacturing services customers, who provide increasingly high-level services with the blurring of the traditional distinctions between OEM and EMS.
Westby said: "There is a valuable synergy between CALCE's work at the OEM level and the needs of our customers, which include EMS and ODM businesses as well as OEMs.
By working together we can deliver broader and deeper benefits to each of these groups".
Dr Osterman added, "The precise areas in which we will cooperate are not completely finalised, but we expect to pay particular attention to lead-free technology, where much work remains to be done to help the industry transition in time to comply with forthcoming directives".
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