Product category:
PCB Assembly Equipment and Tools
News Release from: Universal Instruments | Subject: 4797R HSP
Edited by the Electronicstalk Editorial
Team on 09 January 2004
Compact footprint platform handles
bigger boards
Universal Instruments has trimmed the footprint and increased the maximum board size for its high-speed placement platform.
Universal Instruments has trimmed the footprint and increased the maximum board size for its high-speed placement platform The result is more flexibility in a smaller shop-floor space
This article was originally published on Electronicstalk on 17 Jul 2002 at 8.00am (UK)
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Compact outline for speedy placement machine
New from Universal Instruments, the 4797S HSP high-speed placement machine is the company's newest solution for high-volume, turret-style chip shooting.
Support aids flexible manufacturing
Energy management specialist SatCon Technology has worked with Universal Instruments to complete the integration of a new automated assembly system for future generations of its products.
And because the new 4797R HSP accepts up to 96 feeders, these advantages are not achieved at the expense of lower throughput or complicated scheduling.
Placement speed is maintained at 48,000 components per hour.
The 4797R HSP is capable of handling boards up to 610 x 460mm.
Universal has achieved this within a small machine footprint of just 3.1 x 2.155m.
As well as maximising throughput and flexibility, the new machine also emphasises placement accuracy.
Three-sigma accuracy is 0.08mm for MELFs and small chips, and 0.05mm for leaded components.
"Today's OEM, EMS and ODM businesses insist that every inch of the shop floor should deliver maximum productivity", said Heinz Dommel, Systems Manager of Universal Instruments.
"But the flexibility to run high-value products such as backplanes opens up profitable opportunities.
The 4797R HSP combines outstanding flexibility and space-efficiency, without compromising on throughput or accuracy".
This is the most compact 4797-series HSP machine to feature large board handling capability.
Accepting up to 72 unique components on standard 8mm tape feeders, or 96 unique components with dual-track feeders, the 4797R HSP balances small footprint, easy scheduling, and high throughput.
As well as 48,000 component-per-hour placement performance, the 4797R HSP has a minimum placement tact time of 75ms.
Feeder axis tact time is 90ms, or 80ms with the dual-track feeder.
The new 4797R HSP can operate as a stand-alone machine, or grouped with multiple machines for increased flexibility and volume.
It is ideal for assembling high volumes of standard products, as well as larger panels such as backplanes for networking or server applications, or PC motherboards.
And its wide component range makes it equally productive in high mix environments.
Additional standard equipment includes 12 five-spindle, advanced direct-drive placement heads, and Universal's UCT53 software for offline programming.
Available options include component library data teach, pattern program data teach, BVS barcode validation system, traceability package, BGA/CSP recognition, black light PEC camera, and GEM/SECS II.
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