Product category:
PCB Assembly Equipment and Tools
News Release from: Universal Instruments
Edited by the Electronicstalk Editorial
Team on 06 February 2004
Five more years for placement accord
Universal Instruments and Hitachi High Technologies (HHT) have renewed their successful OEM agreement for a further five years.
Universal Instruments and Hitachi High Technologies (HHT) have renewed their successful OEM agreement for a further five years HHT acquired Sanyo High Technologies, Universal's original OEM partner, in 2003
This article was originally published on Electronicstalk on 17 Jul 2002 at 8.00am (UK)
Related stories
Compact outline for speedy placement machine
New from Universal Instruments, the 4797S HSP high-speed placement machine is the company's newest solution for high-volume, turret-style chip shooting.
Support aids flexible manufacturing
Energy management specialist SatCon Technology has worked with Universal Instruments to complete the integration of a new automated assembly system for future generations of its products.
The partnership has been lucrative for both companies, enhancing Universal's best-in-class product portfolio with class-leading, turret-style high speed placement technology while affording HHT an extensive sales and support network.
Since being first announced in 1989, this agreement has resulted in more than 1200 HSP platforms sold.
The latest high-speed placement machine to use HHT's technology, the 4797L HSP, was recently awarded the 2003 EP and P Excellence Award and 2003 SMT Magazine Vision Award.
In addition to customers' access to the entire line of 4797-series HSP machines, extending the agreement until 2009 will allow further joint efforts to continue.
These include recent line software development work, and may extend in the future to additional joint technical projects, technology transfers, and further product sharing.
Heinz Dommel, Manager, Systems Division at Universal Instruments, said: "I am pleased to renew this valuable relationship and continue to make HHT's best-in-class turret-style high speed placement technology available to a global market by leveraging Universal's worldwide sales and support infrastructure.
The HSP is the perfect complement to Universal's industry-leading flexible fine pitch technologies".
Continued success of the partnership, and sustained market demand for high speed placement equipment such as the 4797L HSP, have allowed the agreement to be renewed several times in the past.
Universal offers the 4797-series HSP alongside its strong modular platform product portfolio, which includes the AdVantis and GSM Genesis placement platforms, as well as cost-effective end-of-line and through hole assembly solutions.
• Universal Instruments: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page

