Product category:
PCB Assembly Equipment and Tools
News Release from: Universal Instruments | Subject: Wafer feeder systems
Edited by the Electronicstalk Editorial
Team on 07 July 2004
Wafer feeder gains multiple-part
flexibility
Universal Instruments has added an online wafer expander option to its wafer feeder system for advanced semiconductor assembly.
Universal Instruments has added an online wafer expander option to its wafer feeder system for advanced semiconductor assembly The online wafer expander will be especially valuable when processing single part number 300mm wafers
This article was originally published on Electronicstalk on 17 Jul 2002 at 8.00am (UK)
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Universal has also retained the wafer feeder's offline wafer expansion capability for multiple-part-number wafer processing.
The Universal wafer feeder is compatible with industry standard wafer sizes, including 12, 8 and 6in, and accepts full 25 wafer cassettes.
It provides a versatile and reliable platform from which to load wafers for a back-end packaging process, and incorporates industry proven techniques for handling wafers.
All other Universal die feeding alternatives remain available, providing maximum flexibility.
Programmable die ejection, theta correction and expansion, combined with wafer mapping and ink dot recognition, bar code identification and tracking of wafers, effortlessly handle the most complex dies in 300mm format.
High-speed throughput is also inherent to the Universal loader's design.
Maximum use of parallel processing has pared tact time as low as 1s per die.
The offline version of the wafer feeder, ideal for multiple-chip-part-number applications remains available.
Designed on a small footprint of 1.17 x 0.94m, the feeder forms part of a space-efficient semiconductor processing capability.
The loader is compatible with class 10,000 clean rooms, allowing customers to quickly adopt Universal's high throughput, small footprint, cost-effective packaging solutions within their existing back-end packaging facilities.
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