Product category:
PCB Assembly Equipment and Tools
News Release from: Universal Instruments | Subject: Platform product ranges
Edited by the Electronicstalk Editorial
Team on 06 October 2004
Lower global prices for platform product
ranges
Universal Instruments has significantly reduced the prices of its platform product ranges in all geographic regions, effective immediately.
Universal Instruments has significantly reduced the prices of its platform product ranges in all geographic regions, effective immediately The objective is to offer customers highly competitive and identical prices around the world
This article was originally published on Electronicstalk on 17 Jul 2002 at 8.00am (UK)
Related stories
Compact outline for speedy placement machine
New from Universal Instruments, the 4797S HSP high-speed placement machine is the company's newest solution for high-volume, turret-style chip shooting.
Support aids flexible manufacturing
Energy management specialist SatCon Technology has worked with Universal Instruments to complete the integration of a new automated assembly system for future generations of its products.
Universal is the first placement equipment vendor to achieve global price consistency.
This simplifies the purchasing process for multinational customers while the aggressive price reduction on the company's AdVantis and Genesis platforms benefits all customers.
These new and highly competitive prices for the platforms include: Genesis Flexible Fine Pitch (FFP), a twin beam modular chip placer combined with high speed FFP capability from $239,000 to $259,000; Genesis High Speed Chip (HSC), with twin beams and two Lightning heads for speeds up to 54,000 components per hour for $299,000; AdVantis Flexible Fine Pitch (FFP), a single beam chip placer with FFP capability for $125k,000; and AdVantis High Speed Chip (HSC), with a Lightning head for speeds up to 30,000 components per hour for $150,000.
Further reading
Fully modular assembly solution
Universal Instruments has enhanced its GSM platform for surface mount component placement.
Irvine takes on complete SMT line
Universal Instruments has installed a complete line solution for Irvine Electronics.
The new prices mean that High Speed Chip (HSC) and Flexible Fine Pitch (FFP) platform customers can now enjoy Universal Instruments' celebrated equipment robustness, reliability and technology advancements for less.
The company's track record of high intrinsic availability is clearly proven by years of uptime in diverse manufacturing environments around the world.
In addition, the new Lightning head deployed in HSC platform configurations is clear evidence of Universal Instruments' technology development proficiency.
The initiative is a milestone in the corporation's quest to become the equipment manufacturer with the lowest costs and broadest range, allowing it to deliver unbeatable value.
The new aggressive global pricing has been made possible by Universal's continuing policy of driving out costs from all its processes, including mandates to design out cost during product development cycles, supply chain optimisation with global sourcing, and a broadened manufacturing base.
"Our 'cost-down' initiatives have been a huge success and we're able to pass the savings on to our customers, with a worldwide, across-the-board platform price reduction", says Gene Heiser, Universal's VP Sales and Marketing.
"We have succeeded in streamlining every part of our operation, securing profitability, and boosting customer value - without compromising quality - and that is now translating directly to new lower platform prices".
• Universal Instruments: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page

