Product category:
PCB Assembly Equipment and Tools
News Release from: Universal Instruments
Edited by the Electronicstalk Editorial
Team on 15 November 2004
15 years of high-speed co-operation
Universal Instruments has celebrated 15 years of its OEM agreement with Hitachi High Technologies (HHT) to market the 4797 HSP high speed, turret-style placement machine.
Universal Instruments has celebrated 15 years of its OEM agreement with Hitachi High Technologies (HHT) to market the 4797 HSP high speed, turret-style placement machine Speaking informally, Heinz Dommel, Manager, Systems Division at Universal Instruments, said, "1989 marked the release of the first computer virus, cold fusion, and the first successful tracking of an asteroid by radar
This article was originally published on Electronicstalk on 17 Jul 2002 at 8.00am (UK)
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That perspective shows how rapidly technology has changed over the last decade and a half.
We have also evolved the 4797 HSP significantly since that time, but the partnership between our two companies has delivered consistent and tangible value to Universal, HHT, and our customers." Since 1989, Universal has distributed over 1500 HSP machines and acted as the catalyst for continuous enhancements to the original platform.
These have led directly to the latest high speed placement machine to use HHT's technology, the 4797L HSP, which was awarded the 2003 EP and P Excellence Award and 2003 SMT Magazine Vision Award.
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Dommel also commented on the synergy between Universal, HHT, and the market for high-speed placement equipment.
He said, "This has been one of those rare partnerships where two companies with complementary investments in technology and sales/support infrastructure combine forces to market a product that delivers a consistently outstanding value proposition.
It is no surprise that this partnership has been so successful for so long, and will continue for many years to come." His words are endorsed by the February, 2004 announcement that Universal and HHT have extended the terms of their agreement for another five years, to 2009.
In addition, Universal has strengthened its product portfolio by marketing Hitachi's GX-H, a four-beam SMT placer, as the Quadris.
This affords Universal a high volume solution that combines turret and overhead gantry technologies to deliver concentrated throughput.
Both the 4797-series HSP and Quadris complement Universal's industry-leading flexible fine pitch technologies, which include the AdVantis and GSM Genesis modular placement platforms, as well as cost-effective end-of-line and through hole assembly solutions.
Background: In 1989, Universal Instruments announced it had agreed with Sanyo High Technology company to distribute the Japanese company's high speed placement machines on an OEM basis.
At the time this was a ground-breaking move in the electronics industry, as such close co-operation between an essentially western company and a Japanese counterpart was distinctly uncommon.
But both parties had confidence in the arrangement, as each was quite clear about what it expected to gain and what it felt it was contributing to the partnership.
On this basis, the two companies have successfully evolved the platform along an aggressive technology path to address modern production trends.
Also, since 1989, Universal has continually invested in technical support skills and in expanding its network of technical centres to ensure that its 4797-series HSP customers enjoy the best possible product and process support.
In 2002, Hitachi High-Technologies Corporation acquired Sanyo High Technology Co, , Universal's original partner, and renamed the UK distributor Hitachi High-Technology Instruments Corporation.
This has further strengthened the agreement applying to the 4797-series HSP by supporting a greater degree of flexibility to serve the market, including the option to be more aggressive where this is appropriate.
In addition, the acquisition by Hitachi has raised the possibility of further product sharing in the future.
This should enable the 4797 HSP collaboration to continue even further into the future, while strengthening links between the two companies on many other levels.
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