Product category:
PCB Assembly Equipment and Tools
News Release from: Universal Instruments | Subject: AdVantis XS
Edited by the Electronicstalk Editorial
Team on 29 August 2005
Platform shifts to system-in-package
assembly
The AdVantis XS is the latest Platform placement system from Universal Instruments.
The AdVantis XS is the latest Platform placement system from Universal Instruments Designed specifically for the convergence of semiconductor and standard surface mount assembly, the new system deploys Universal's innovative VRM linear motors for exceptional accuracy and repeatability
This article was originally published on Electronicstalk on 21 Jul 2006 at 8.00am (UK)
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AdVantis XS is the natural evolution of the company's acclaimed GSMxs, delivering similar accuracies of +/-9um at +/-3 sigma, but with a 25% increase in feeder capacity for greater on-machine inventory and a 15% speed improvement.
At the same time, the advanced materials engineering and optimised design of the AdVantis platform offers customers a highly competitive price some 25% lower than its predecessor, and Universal's platform philosophy ensures high levels of backward compatibility, shared resources and common interfaces - even extending to Universal Instruments' GSM Genesis platform range.
"Overall, our studies demonstrate that AdVantis XS can cut cost of ownership by 40% which, in turn, reduces cost-per-placement in the competitive flip chip market segment", claims Richard Boulanger, Vice President of the Advanced Semiconductor Assembly division at Universal Instruments.
"It provides a lower-cost alternative sought by those in low-margin assembly applications who still require high accuracy placement of flip chip and other advanced packages without sacrificing Universal's time-honoured platform strengths - robustness, modularity and scalability - all backed by superior expertise and support".
The new linear-motor-driven AdVantis XS delivers all the capability and functionality demanded by high-end assembly including high magnification cameras, flip chip algorithms, low force capability, heated spindles, fluxing, dispensing, and a variety of feeder types.
It is also Class 1000 clean room compatible.
"Leveraging Universal's credentials as a pioneer of leading-edge placement platforms, the high accuracy AdVantis XS extends equipment capabilities into system-in-package (SiP) assembly", Boulanger said.
"The state of the art handling, vision, and placement technology of the AdVantis XS allows manufacturers to perform challenging flip chip processes, process bare dies and assemble complex optoelectronic components".
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