Product category:
Test Accessories
News Release from: Unitemp | Subject: Espec TSB series
Edited by the Electronicstalk Editorial
Team on 30 March 2007
Liquid chamber provides severe thermal
shocks
Liquid to liquid thermal shock chambers are ideal for semiconductor testing, and can also be used with electronic, electrical, automotive components and small subassemblies.
Unitemp has a new range of liquid to liquid thermal shock chambers Although ideal for semiconductor testing, the range can also be used with electronic, electrical, automotive components and small subassemblies
This article was originally published on Electronicstalk on 22 Nov 2007 at 8.00am (UK)
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The chambers cater for the diverse requirements of laboratories, research facilities and industry.
The Espec TSB series are constructed inside and out from top quality stainless steel.
The hot-bath temperature range is from 70 to 200C, and the cold-bath temperature range is -65 to 0C.
The innovative TSB range reduces the problem of continual loss of expensive testing fluids by several methods.
One of which is enhanced sealing, preventing the leakage of evaporated thermal fluid from the test area.
Another is a fan that draws air to a condensing coil that turns evaporated fluid into a liquid, returning it to the baths.
A refrigerated cooling ring at the top of the hot bath helps to limit evaporative losses.
All units incorporate a separation filter for removing water from the thermal fluid.
A new ozone friendly HFC refrigeration circuit that reduces energy consumption saves space and reduces weight.
Improvements in the refrigeration design have reduced power consumption by 52%, and noise levels to as low as 61dB.
The refrigeration change also reduces the chamber footprints by more than 15%.
The SCP-220TS touch screen programmable controller comes with an intuitive screen interface that makes set up programming and test monitoring simple.
Expanded interface options allow chamber communication and control from an external PC.
Liquid to liquid thermal shock is typically conducted to apply very strong, repetitive thermal stress to test pieces.
It can model a product's ability to withstand thermally induced size changes, crack resistance, hermetic integrity, and changes in electrical properties.
This form of testing provides a very rapid temperature shock recovery of conditions, and can significantly reduce testing time by requiring shorter soaks and fewer cycles.
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