Upgraded bonding heads ease reflow tasks

A new and improved range of bonding heads is available for all hot-bar reflow soldering and heat-seal bonding applications.

A new and improved range of bonding heads is available for all hot-bar reflow soldering and heat-seal bonding applications.

These bonding heads offer maximum productivity and consistent process control.

The bonding heads are modular, compact, rigid and easily adjustable.

The modular approach enables users to upgrade or reconfigure their systems when needed.

The compactness makes it possible to build a system with optimum floor space usage.

The rigidity gives users the highest connection accuracy with fine pitch applications, long hot-bar lengths and even the highest bonding forces.

There is a multitude of mounting possibilities, offering an adjustable height range of 50mm.

The stroke of the bonding heads is 25 or 38mm.

All bonding heads can be mounted on a post or gantry construction.

Hot-bar plan parallelism and thermode tilt can be adjusted with adjustment screws.

A cover shields all adjustments from unwanted operator interference.

To achieve optimum force accuracy, the bonding heads are available in three force ranges.

The low force range starts at 8 to 80N, the mid range covers 30 to 500N.

The highest range goes from 250 to 1250N.

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