Novel dry PCB cleaner improves bond quality

The Plasmapen is a novel automated cleaning tool that prepares PCBs and LCDs for stronger and more reliable heat-seal connections and anisotropic conductive adhesive bondings.

The Plasmapen is a novel automated cleaning tool that prepares PCBs and LCDs for stronger and more reliable heat-seal connections and anisotropic conductive adhesive bondings.

This makes the Plasmapen a good alternative to the conventional manual wet-chemical cleaning with acetone, ethyl alcohol or boiling point spirit.

The elimination of chemicals removes the risk of fire hazard.

It also improves the operator friendliness of the bonding process.

The automated cleaning eliminates operator influence, giving traceable cleaning operation and constant product quality.

Pull tests show significant stronger connections compared with connections made with conventionally cleaned substrates.

This additional strength further improves the reliability of the end product.

In operation, ordinary compressed air is accelerated through the nozzle of the Plasmapen.

Inside the nozzle an electrical arc splits the air into separate particles, which will bind themselves to (organic) pollutants on the substrate.

These pollutants are blown away by the kinetic energy of the cleaning process.

The Plasmapen can be used as a stand-alone device or can be built into fully automated HSB/ACF systems.

Back to top