Market opportunities for 3D chip scale packaging

Venture Development Corp and Circuits Assembly are launching a multi-client market research study to analyse global market opportunities for 3D chip scale packaging solutions.

Venture Development Corp and Circuits Assembly are launching a multi-client market research study to analyse global market opportunities for 3D chip scale packaging solutions.

Prepublication sponsorship is available now.

This research programme is based on extensive telephone interviews with suppliers, integrators, and other 3D packaging market participants.

Key program deliverables will include: detailed market definitions and segmentations; 3D packaging technology descriptions; engineering approaches (thermal, power management etc); market estimates and forecasts across product categories and application segments; analysis of current and future applications; OEM/integrator requirements and preferences; competitive position of 3D packaging component and solution suppliers; and key success strategies.

Lisa Bastin, Editor-In-Chief of Circuits Assembly, says: "Although 3D chip scale packaging exceeds many performance demands and looks promising, there are still challenges that lie ahead such as cost and integration issues".

"We are excited to team with VDC to find answers to these issues and create a road map for the industry".

Rick Barnard, Practice Director of VDC's Electronic Components and Advanced Materials group, says: "As the technology landscape becomes more mobile-oriented and time-to-market challenges increase, system designers are faced with finding the optimal combination of form and function".

"This study will address important issues surrounding the 3D chip scale packaging opportunity by providing a granular, relevant market analysis with technical and developmental considerations".

Circuits Assembly will be sharing with VDC its expertise of the industry to assist the research effort.

Circuits Assembly's assistance will: enhance and further develop the contents and scope of the report, based on its knowledge of 3D chip scale packaging trends, business opportunities in the global market place, and innovations and technological developments in the industry; and bolster VDC's primary research program by queuing its massive proprietary database with VDC's research tools.

Interim findings from the analysis will be shipped in July 2004; the completed report will be delivered in August 2004.

The prepublication price of the report is $4450.

Back to top