Interconnection process promises a revolution

An "evolutionary" technology for both printed circuit boards and PCB assemblies promises to dramatically improve the way electronic products are made.

Verdant Electronics has conceived and is developing an "evolutionary" new technology for both printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) that promises to dramatically improve the way electronic products are made.

This new methodology greatly reduces the number of process steps used to create electronic assemblies, simplifying PCB fabrication and assembly, thereby reducing cost and improving reliability.

The core idea is to build and interconnect electronic assemblies in reverse order from the traditional methods.

Rather than having components mounted on PCBs and soldered, fully tested and burned IC packages and components of all types are placed on a carrier, encapsulated and subsequently plated with circuits making direct connection to component terminations without solder.

The reverse-order interconnection process, which takes inspiration from earlier bare die multichip module technologies of the 1990s, is significant and far-reaching in its implications.

For example, the three currently defined sectors for electronics manufacturing include PCBs, components and assembly.

These three sectors are now reduced to two because printed circuit manufacture and assembly are essentially fused into one continuous manufacturing operation.

Verdant Electronics' novel concept leads to the elimination of many inefficient processes associated with PCB fabrication and PCB assembly.

A huge benefit is the elimination of solder from the assembly process which has become a highly contentious and frustrating issue as the industry moves to "lead-free" soldering technologies.

The new approach will obviate the many problems associated with lead-free solder while creating electronic products that use less energy in manufacture, use fewer materials in construction, will not employ any restricted materials, and will ultimately be smaller, lighter, less costly and more reliable.

This is a very "green" technology that uniquely supports the global movement toward more environmentally friendly electronic products.

Verdant founder and developer of the reverse order interconnection process technology, Joseph (Joe) Fjelstad, comments on the response from industry peers: "I have been extremely pleased with the responses I've received from industry experts who have reviewed the methodology".

"They have expressed great support for the idea but, more importantly, they have been providing valuable feedback which will enhance the development and expand future opportunities for this technology, which can be deployed using existing materials and equipment".

Fjelstad continues: "This technology builds on a foundation of important technologies that were developed for microelectronics including IC and module packaging in the 1990s by GE and others but which were constrained from broad deployment by die yield problems".

"By moving to the use of tested and burned in IC packages, the yield problems associated with traditional solder assembly technologies, which is where the problems now lie, virtually disappear".

Fjelstad concludes: "Simplicity lies at the heart of the method and that is the key".

"The 14th century English philosopher and logician William of Occam observed: 'It is vanity to do with more that which can be done with less', and this simple but clear idea has become a guiding principal for Verdant Electronics".

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