Product category:
DC/DC Convertors
News Release from: Vicor UK | Subject: V048K015T80
Edited by the Electronicstalk Editorial
Team on 18 September 2003
Isolated POL convertor sets new records
Vicor has released its first VI chip voltage transformation module (VTM), the V048K015T80.
Vicor has released its first VI chip voltage transformation module (VTM), the V048K015T80 The VTM breaks records for speed, density and efficiency to meet the demands of advanced DSP, FPGA, ASIC, processor cores and microprocessor applications at the point of load (POL) while providing isolation from input to output
This article was originally published on Electronicstalk on 3 May 2001 at 8.00am (UK)
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The VTM achieves a response time of less than 1us and delivers up to 80A in a volume of less than 0.25in3 while converting 48 to 1.5V with unprecedented efficiency.
VTMs may be paralleled to deliver hundreds of amperes at an output voltage settable from 1.0 to 1.8V DC, at no load, and 0.9 to 1.7V DC at full load.
The VI chip VTM is a key component of the factorised power architecture recently introduced by Vicor.
Further reading
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VCAD (Vicor Configurable Automated Design) is a patented automated design tool that gives power designers flexibility and real-time control over the design and manufacture of power solutions.
100A-rated socket puts DC/DC convertors onboard
Vicor has introduced a new series of through-hole sockets for use with pin-compatible Vicor 2nd-generation DC/DC convertor and accessory modules.
Passive solution to harmonic current compliance
Vicor has developed a new solution for compliance with EN harmonic current and EMI standards.
Unlike the intermediate bus architecture, which feeds nonisolated POL convertors or VRMs at inefficiently low bus voltages, factorised power leverages a voltage, designated Vf, controlled to minimise distribution losses while allowing energy to be densely stored for sudden delivery to or retrieval from the load by isolated VTMs.
VTMs have 1MHz bandwidth and can provide efficient bidirectional power flow with the load, limiting voltage excursions due to instantaneous load surges or dumps.
The open loop output resistance, Rout, of the V048K015T80 VTM is approximately 1.3mohm and may be used to provide automatic voltage positioning for microprocessor loads.
With its small SMD footprint of only 1in2, the VTM obsoletes VRM subassemblies and connectors, noted for their undesirable series impedance and heat generation.
The need for limited-life electrolytic or tantalum capacitors at the POL characteristic of VRMs is also eliminated: the VTM effectively multiplies capacitance present at its input to its output with a gain in excess of 1000 at up to 1MHz.
The net results are higher performance and savings in material, board space and system cost.
The VTM V048K015T80's output is 1.5V DC from a nominal 48V DC input and is controllable at up to 80A over the range of 0.9 to 1.8V DC with a Vf range of 32-57.6V DC.
The VTM can be operated either open- or closed-loop depending on the output regulation needs of the application.
Operating open-loop, the VTM output tracks its Vf input voltage with a transformation ratio of 1/32, and an output resistance of 1.3mohm, to enable applications requiring a programmable low output voltage at high current and high efficiency.
Closing the loop back to an input preregulation module (PRM) or DC/DC convertor may be used to compensate the output resistance.
The 1.5V VTM achieves break-through current density of 320A/in3 in a VI chip package compatible with standard pick-and-place and surface mount assembly processes.
The VI chip BGA package supports in-board mounting with a low profile of 4mm over the board.
A VI chip J-leaded package option will support onboard surface mounting with a profile of 6mm over the board.
The VI chip outline dimensions are 32 x 21.5 x 6mm.
The VI chip BGA package provides flexible thermal management through its low junction-to-case and junction-to-BGA thermal resistance.
The VI chip J-lead package option will provide equivalent thermal management performance with its junction-to-board thermal resistance.
The VTM's high efficiency, low thermal impedances and safe operating temperature range eliminate the need for a heat sink in typical applications.
A 6mm pin fin heatsink option is available for operation at maximum load in harsh thermal environments.
The VTM V048KT015T80 in the VI chip BGA package is priced as low as 31c/A in OEM quantities and is available in JEDEC trays or taped and reeled for automated pick and place and SMD assembly.
Delivery is 6 weeks ARO.
Pre-assembled evaluation boards are available for $49 and include the VTM.
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