Isolated POL module delivers 100A

Edited by the Electronicstalk editorial team Aug 26, 2004

The V048K015T100 VI Chip Voltage Transformation Module (VTM) is the first such product capable of 100A.

The V048K015T100 VI Chip Voltage Transformation Module (VTM) is the first such product capable of 100A.

The new device breaks records for speed, density and efficiency to meet the demands of advanced DSP, FPGA, ASIC, processor cores and microprocessor applications at the point of load (POL) while providing isolation from input to output.

It delivers up to 100A from a VI Chip package less than 4.1cm3 in volume and responds in a fraction of a microsecond to no-load/full-load and full-load/no-load step changes.

Optimised for very low output voltages at high currents, it has an efficiency of 90% at 1.2V/100A, and better than 92% at 50A.

The VTM may be paralleled to deliver hundreds of amps at an output voltage settable from 0.8 to 1.6V DC.

As a point-of-load current multiplier (32x) with megahertz bandwidth, the VTM can eliminate bulk capacitors and the high power distribution losses caused by busing high currents to the POL.

VTMs maximise POL density and efficiency while minimising total system cost.

The VTM V048K015T100 is rated for a maximum continuous output of 100A up to 1.5V output and 150W up to 1.6V over an input range of 26 to 55V DC.

It can be operated either open- or closed-loop, depending on the output regulation needs of the application.

Operating open loop, the output voltage tracks its input voltage with a transformation ratio of 1:32 and an output resistance of 1.0mohm, to enable applications requiring a programmable low output voltage at high current and high efficiency.

Closing the loop back to an input preregulator module (PRM) or DC/DC convertor compensates for the output resistance.

The 1.5V VTM achieves breakthrough current density of 24A/cm3 in a VI Chip package compatible with standard pick-and-place and surface-mount assembly processes.

The VI Chip BGA package supports inboard mounting with a low profile of 4mm over the board.

J-lead package options support onboard surface mounting with a profile as low as 6mm over the board.

The VTM V048K015T100 in the VI Chip BGA package is priced at less than $0.20/A in OEM quantities and is available in JEDEC trays or taped and reeled for automated pick and place and SMD assembly.

Prototype quantities are available now.