Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: VIA Technologies | Subject: C7-M ULV processor
Edited by the Electronicstalk Editorial
Team on 13 March 2006
Processor powers ultraportable devices
The VIA C7-M ULV processor promises unprecedented power efficiency to enable an exciting range of ultracompact ultraportable devices.
Showcased at CeBIT 2006, the VIA C7-M ULV processor promises unprecedented power efficiency that enables an exciting range of ultracompact ultraportable devices As users look for a new breed of devices that fuses communication, content support, and computing all in one easy to carry package, VIA C7-M ULV processors are enabling radically small form factor designs that still retain the performance and flexibility of a full PC
This article was originally published on Electronicstalk on 24 Aug 2005 at 8.00am (UK)
Related stories
Chipset adds frugal multimedia to notebook design
The VIA VN800 is the first chipset solution for the VIA C7-M processor with DDR2 memory support for fast and efficient system memory access and hardware MPEG-2 decoding for flawless DVD playback.
Mainboards power up Internet telephony
VIA EPIA Mini-ITX mainboards have been adopted by UK-based Telappliant to power a new range of ArenaTalk voice servers that provide a complete "out of the box" Internet telephony solution for SMEs.
Working together with leading industry partners the VIA C7-M ULV processor is creating exciting opportunities for entertainment, productivity, and communication products with a portability never before thought possible.
"The VIA C7-M ULV processor is the result of a concerted design effort to create the world's lowest power x86 processors that will enable a much needed class of mobile devices", commented Epan Wu, Deputy Director, CPU Product Marketing, VIA Technologies.
"Featuring the best performance-per-watt operation in the industry, the VIA C7-M ULV processor delivers the performance needed to put a full PC into the palm of your hand".
Further reading
Chipset provides flexible multimedia solutions
A new chipset extends VIA Technology's leadership in providing affordable and scalable graphics solutions with rich multimedia and connectivity for mainstream and entry-level PC markets.
Mini-ITX board powers home entertainment system
VIA EPIA Mini-ITX mainboards have been selected by MacroSystem, a renowned developer of high-end video solutions, to power its new Enterprise home entertainment system.
"As consumers lead increasingly mobile lifestyles, ultramobile PCs will provide an exciting new solution that makes it easier to access digital content - such as movies and music - and connect to almost anyone, and accomplish virtually any task while on the go", said Otto Berkes, General Manager of the Mobile Platforms Division at Microsoft Corp.
"The VIA C7-M ULV processor is enabling the production of smaller form factors that meet the needs of mobile consumers, while maintaining the functionality benefits of a full-sised Windows-based PC".
Paving the road for a new range of VIA C7-M ULV processor devices is PBJ, a Japan-based OEM, with its compact "SmartCaddie" UMPC device that together with Microsoft Windows XP with Microsoft Touch Pack software is aimed at enabling a revolutionary entertainment experience in the home.
"The VIA C7-M ULV processor has enabled us to create products with outstanding mobile characteristics that open the door to a new way to interact with a PC-based device", said Masatoshi Takahashi, CEO, PBJ.
The CTO of PBJ, Kimitoshi Murakami added: "With the VIA C7-M ULV processor's amazingly low power consumption and cool operation, we were able to achieve battery life and a unique form factor design, while still maintaining the performance one would expect to do everyday PC tasks".
Based on the VIA CoolStream architecture, and manufactured using IBM's 90nm SOI process, the VIA C7-M ULV processors are available at speeds from 1.0 to 1.5GHz with a maximum thermal design power (TDP) as low as 3.5W, and idle power as little as 100mW, ensuring unparalleled battery life.
This is complemented by a low profile nanoBGA2 package measuring just 21 x 21mm, enabling designs with drastically reduced weight, size and thickness.
• VIA Technologies: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
