Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: VIA Technologies | Subject: CX700
Edited by the Electronicstalk Editorial
Team on 07 April 2006
Single chip embeds full processor
chipset
The CX700 integrates all the cutting-edge features of a modern chipset's North and South bridges into a single, compact and highly power-efficient package for the embedded market.
VIA Technologies has unveiled its CX700 digital media IGP chipset for the VIA C7 and Eden processor platforms Billed as the most advanced x86 embedded chipset, the CX700 integrates all the cutting-edge features of a modern chipset's North and South bridges, including rich video graphics, HD audio, and DDR2 and SATA II support, into a single, compact and highly power-efficient package designed specifically for the embedded market
This article was originally published on Electronicstalk on 27 Sep 2006 at 8.00am (UK)
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"Fully embodying VIA's design strategy of shrinking the platform while supporting contemporary video, audio, memory and peripheral technologies, the CX700 represents the next phase of innovation in enabling more compact and sophisticated x86 systems".
A host of leading digital media, memory and connectivity technologies are packed into the single-chip package of the VIA CX700.
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VIA's renowned memory controller technology has been incorporated into the VIA CX700, with support for both DDR400 and the high-bandwidth DDR2533 memory up to 4Gbyte with ECC capability, and 32bit as well as 64bit system memory to extend performance, design and cost flexibility to developers.
Broad connectivity comes with support for SATA, SATA II and PATA drives, two COM and six USB2.0 ports, and four PCI slots, allowing for considerable flexibility in board configuration.
Moreover, developers can also integrate support for ISA through an ITE PCI bridge chip, combining legacy ISA connectivity with high bandwidth DDR2 memory support for far more powerful embedded systems.
Flexibility is extended to display technologies, with the VIA CX700 integrating a multiple-configuration LVDS/DVI transmitter, a popular feature for embedded systems, as well as standard TV-out, and incorporating DuoView to enable dual screen display.
The VIA CX700 exemplifies VIA's design philosophy of reducing the size of the platform in order to enable ever smaller, cooler and lighter systems.
In the CX700, VIA has integrated all the key functionality of both the North and South bridges of a regular VIA chipset into a single chip package exactly the same size as a North bridge, ie 37.5 x 37.5mm, representing a saving of over 34% in board real estate.
This represents a major breakthrough for the embedded industry where ultra compactness is essential, and will have significant benefit for embedded boards such as PC/104 and VIA EPIA mainboards.
Complementing the power-efficient VIA C7 and fanless VIA Eden processors it supports, the VIA CX700 is based on a highly sophisticated power efficient architecture that enables such rich integration into a compact package with a maximum power envelope of just 3.5W.
A number of key power management technologies are incorporated that monitor activity and dynamically control power according to system load requirements.
Targeted for key embedded applications such as point of sales (POS) equipment, industrial PCs and ultracompact low-power desktop systems such as thin clients, the VIA CX700 has been designed from the ground up to deliver excellent performance, features and power efficiency.
The reduction in board space and operating power requirements together with the extensive multimedia, memory, connectivity and display flexibility provides embedded customers with the ideal chipset to take their ultracompact systems to the next stage.
The benefits of the VIA CX700 have been recognised by several leading embedded industry players, including Advantech, Diamond Systems, Freetech Flexus Computer Technology and WinSystems.
"Until now, creating an ultracompact form factor mainboard with unparalleled visual connectivity has been a complex process".
"However, with the VIA CX700 Advantech SOM-ETX solution can offer our customers a solution that supports dual screens, CRT/TV and direct LVDS connection all from a single silicon solution", said Jeff Chen, Chief Technology Officer, Advantech.
"Highly integrated, very low-power products like the CX700 from VIA are key to small, high-performance single board computer designs", said Robert A Burckle, Vice-President of WinSystems.
"VIA has engineered the right balance of features and performance into this new x86-compatible chipset that are ideal for the embedded market".
"VIA's innovation in its embedded chipset family is setting new standards for low power dissipation at a high performance level in the embedded market place", said Matt Schiltz, General Software's CEO.
"We are pleased to offer VIA customers Embedded BIOS 2000 support for this exciting new member of the VIA family of silicon products, the VIA CX700".
"General Software is committed to working with VIA to help ensure the continued success of their embedded customers".
The VIA CX700 is expected to be available in volume quantities later in Q2 2006.
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