Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: VIA Technologies
Edited by the Electronicstalk Editorial
Team on 18 May 2006
Technology forum lines up heavy hitters
An impressive array of top executives from leading industry players will address the seventh VIA Technology Forum (VTF2006) in Taipei from Wednesday 7th June to Friday 9th June 2006.
An impressive array of top executives from leading industry players will address the seventh VIA Technology Forum (VTF2006) in Taipei from Wednesday 7th June to Friday 9th June 2006 VTF2006 will be opened by Wenchi Chen, President and CEO of VIA, who will expand on VIA's leadership in developing exciting new technologies that are driving the proliferation of digital intelligence
This article was originally published on Electronicstalk on 18 Aug 2008 at 8.00am (UK)
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The keynote session will also feature Phil Hester, Corporate Vice President and Chief Technology Officer at AMD, and Microsoft's Otto Berkes, Ultra-Mobile PC General Manager, who will highlight the latest trends in x86 performance and software development that together are facilitating the digital-everywhere world we are entering.
More than 20 high-level executives from key organisations including AMD, ASE, Citrix, HP and Microsoft will offer insights into how the computing, communications, applications and content communities can work together in creating ground-breaking new usage models.
This broad cross-industry support reflects the value of the forum in examining the key trends in strategic personal, business and emerging market technologies.
"VTF continues to provide the leadership and direction required for the industry to design and develop our digital world of tomorrow", said Richard Brown, Vice President Corporate Marketing, VIA Technologies.
"We look forward to hosting an exciting program of covering the hottest topics and fastest growing markets in the industry, as well as key areas of technology innovation".
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