Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: VIA Technologies
Edited by the Electronicstalk Editorial
Team on 09 June 2006
Miniaturisation remains key PC platform
strategy
VIA President Wenchi Chen has laid out a strategy of continuing to push the limits on miniaturisation of the PC platform based on its unrivalled power efficiency and rich feature integration.
Speaking at this week's VIA Technology Forum, Wenchi Chen, President and CEO of VIA Technologies laid out VIA's strategy of continuing to push the limits on miniaturisation of the PC platform based on its unrivalled power efficiency and rich feature integration Centred around the key theme of how miniaturisation and integration on the PC platform is accelerating the extension of the PC platform into new form factors, new usage models and new markets, thereby prompting the proliferation of digital intelligence, Chen outlined VIA's comprehensive strategy covering silicon, platform and system level innovation in driving the transition of the PC to devices with consumer electronics appeal
This article was originally published on Electronicstalk on 24 Aug 2005 at 8.00am (UK)
Related stories
Chipset adds frugal multimedia to notebook design
The VIA VN800 is the first chipset solution for the VIA C7-M processor with DDR2 memory support for fast and efficient system memory access and hardware MPEG-2 decoding for flawless DVD playback.
Mainboards power up Internet telephony
VIA EPIA Mini-ITX mainboards have been adopted by UK-based Telappliant to power a new range of ArenaTalk voice servers that provide a complete "out of the box" Internet telephony solution for SMEs.
"These days, the industry is talking about performance per watt, which is important on a silicon level; however, we believe that the industry should be thinking of new metrics, such as features per square inch at the platform level, and functionality per pound at the mobile system level, or per litre for desktop systems", said Chen.
Underlining these market metrics at the silicon level, Chen showed an early preview of John, the next advance in the VIA CoreFusion processor platform series that combines a VIA C7-M mobile processor core with the very latest core logic integrating both North and South Bridges, the upcoming VIA VX700 mobile chipset.
As a processor plus core logic in a single, complete package, John will play an important role in maintaining the pace of miniaturisation especially in the mobile space, when it is launched later this year.
Further reading
Chipset provides flexible multimedia solutions
A new chipset extends VIA Technology's leadership in providing affordable and scalable graphics solutions with rich multimedia and connectivity for mainstream and entry-level PC markets.
Mini-ITX board powers home entertainment system
VIA EPIA Mini-ITX mainboards have been selected by MacroSystem, a renowned developer of high-end video solutions, to power its new Enterprise home entertainment system.
Virtual drive application boosts laptop security
A new secure virtual drive application uses the PadLock Security Engine in C7 and C7-M processors to enable real-time encryption of data on local storage devices using military-grade algorithms.
At the system level, there was a preview of the VIA Vogue PC, a new concept in personalised PCs that combines a full featured PC module with a "wardrobe" of designer shell outfits, enabling consumers to select a look to suit each environment.
More will be revealed in Q3 2006 about this exciting concept, which looks set to redefine the lifestyle PC.
Chen highlighted how VIA's leadership on power efficiency is the catalyst driving the convergence of notebooks and handhelds into new device categories such as UMPCs, like those of partners TabletKiosk and PBJ, and further to PC phones, such as the DualCor cPC, which combines full PC functionality with a PDA and a phone in a ultra compact handheld form factor.
With their unmatched performance per watt operation, VIA's mobile and UMPC platforms are powered by the highly power efficient VIA C7-M mobile processor family, as the regular and ultra-low-voltage SKUs, respectively, with corresponding mobile chipsets for feature rich, slimline devices.
VIA also espoused its strategy on the desktop side, working with partners like AMD on platforms such as the VIA K8M890, which was demonstrated during the keynote running Microsoft Windows Vista Beta 2 with one of the new AMD Socket AM2 processors.
The VIA pc-1 Initiative is another key area that has greatly benefited from VIA's leading power efficient technologies, as illustrated by the onstage demonstration of the VIA pc-1 PHD Appliance reference design running off a standard 12V car battery.
The PHD appliance is a ruggedised system designed to withstand the environmental challenges of unstable power, and excessive heat and dust prevalent in emerging markets, and able to operate effectively with alternative energy sources such as car batteries and solar power.
Wayan Vota of Geekcorps gave some fascinating insights on the deployment of VIA's power efficient technologies in the desert regions of Mali, including a broadcast station serving the remote Bourem Inaly community, and a new project to enable marketplace sales of asynchronous cyber services such as e-mail and voicemail, named "Cybertigi"; this will be the focus of Vota's presentation during Friday's Emerging Markets Technology Track.
"By focusing on miniaturisation, VIA is taking an alternative path to enabling true product differentiation at all levels of the industry", commented Chen.
"From innovative approaches to silicon and platform feature integration right through to facilitating system innovation for partners in all areas of the industry, from desktop to mobile to handheld, VIA is allowing partners to add real value and to grow the market for all of us".
• VIA Technologies: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page

