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Product category: Microprocessors, Microcontrollers and DSPs
News Release from: VIA Technologies | Subject: VX700 chipset
Edited by the Electronicstalk Editorial Team on 11 July 2006

Chipset crams in more for ultramobile
PCs

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The VIA VX700 chipset builds on the success of the VIA Ultra Mobile platform in UMPC devices, enabling reduction of mobile form factors by up to 40%.

VIA Technologies has announced the VIA VX700 chipset to build on the success of the VIA Ultra Mobile platform in UMPC devices, enabling reduction of mobile form factors by up to 40% UMPCs (ultramobile PCs) is an exciting new category of devices that can fit comfortably into a pocket or handbag enabling users to access and interact with their entire digital world wherever they go

Creating exciting opportunities for entertainment, productivity, and communication focused products the VIA VX700 is the next step in this mobile future, enabling smaller form factor "computing" devices with reduced power consumption and enhanced functionality.

As the first single chip implementation of its kind for ultra mobile devices, the VIA VX700 continues VIA's history of chipset innovation and blazes a strong path for a new breed of digital companions.

"The VIA VX700 sets a new industry milestone for functionality and performance in a single chipset package", commented Chinhwaun Wu, Special Assistant to the President, Processor Platform Product Marketing, VIA Technologies.

"Together with the VIA C7-M processor, VIA can now offer a platform that breaks form factor barriers while maintaining comprehensive performance, a leading feature set, and ultra-low-power operation for longer battery life".

Leading the way into a new category of ultramobile devices is DualCor Technologies' cPC, a revolutionary new mobile computing device that brings together all the capabilities of a personal computer and a mobile communications device in a sleek but rugged, handheld form factor.

"The VIA VX700 chipset together with the VIA C7-M ULV processor has enabled us to create a new convergence device that combines the convenience of a digital communications device, with the power of a conventional PC in a thin, elegant machine", commented Rob Howe, President of DualCor Technologies.

"The VIA ultramobile platform featuring the VIA VX700 has been critical in helping us achieve the cPC's small size and enhanced battery life, while still providing the performance that today's mobile user needs for everyday PC tasks".

The VIA VX700 breaks new ground by enabling platforms for the smallest, coolest and lightest systems.

Designed specifically for today's ultrathin and light notebooks and ultramobile devices, the VIA VX700 integrates all the cutting-edge features of a modern chipset's North and South bridges into a single chip package measuring just 35 x 35mm, generating a silicon real estate saving of over 42%.

A host of leading digital media, memory and connectivity technologies are packed into the single-chip package of the VIA VX700.

Enhanced video quality is provided through the proven VIA UniChrome Pro II IGP core with its 128bit 2D/3D graphics.

The Chromotion video engine provides powerful image enhancement technology delivering a Hi-Def visual experience including advanced video acceleration for MPEG-2, MPEG-4 and WMV9.

VIA's renowned memory controller technology has been incorporated into the VIA VX700, with support for both DDR and the latest low power high-bandwidth DDR2 memory modules.

This includes support for 32bit DRAM modules enabling a further reduction in form factor.

The VIA Vinyl HD audio controller supports up to eight high definition channels delivering a richer all-round digital media experience.

Broad connectivity comes with support for SATA II and PATA drives, six USB2.0 ports and four PCI slots.

And flexibility is extended to display technologies, with the VIA VX700 integrating a multiconfiguration LVDS/DVI transmitter for connection to LCD and CRT/HDTV interfaces.

The VIA VX700 is expected to be available in volume quantities later in Q3 2006.

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