Mini-RDIMMs stack up memory advantages

Viking InterWorks is supporting the highest density 244-pin Mini-RDIMMs in the industry with its latest offering, a 4Gbyte module.

Viking InterWorks is now shipping a 4Gbyte DDR2 244-pin Mini-RDIMM based on 512Mbit DDR2 monolithic die and its patented RAM-Stack packaging technology.

Currently, Viking InterWorks is supporting the highest density 244-pin Mini-RDIMMs in the industry.

Viking InterWorks' RAM-Stack packaging technology has superior thermal and electrical properties when compared with other stacking methods.

The RAM-Stack package exhibits a low junction-to-case and low junction-to-board thermal resistance.

In addition to these thermal benefits, RAM-Stack enables the stacking of up to four DRAMs, therefore eliminating the need for dual die package (DDP) devices.

"Viking InterWorks continues to support OEM customers with innovative solutions for their memory problems", said Adrian Proctor, Vice President of Marketing for Viking InterWorks.

"The RAM-Stack devices used to build this 4Gbyte MiniRDIMM have been tested to ensure superior electrical loading characteristics versus alternative stacked or DDP-based module offerings".

The 4Gbyte Mini-RDIMM has four ranks of 512Mbit DDR2 DRAMs configured as 512M x 72bit operating at 533MHz (PC2-4200).

Future designs will use 1Gbit DDR2 DRAM enabling 8Gbyte of RAM on Mini-DIMM and VLP DIMM form factors.

The current module has been designed to support both standard registered and address parity systems requirements as defined by JEDEC.

Viking InterWorks continues to advance its technology leadership role by proactively developing products required for the server, telecommunications and embedded markets.

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