Orders roll in for inspection system

A leading semiconductor manufacturer will use Vistec's LDS3300 C macro inspection system for front, back and macro inspection and review of 45 and 32nm devices.

Vistec Semiconductor Systems has received multiple orders for its LDS3300 C macro inspection system from a leading semiconductor manufacturing and technology company.

The systems will be used for front, back and macro inspection and review of 45 and 32nm devices.

The first two purchase orders for the automated macro defect inspection system have already been posted, worth more than US $4 million, and several further orders for other 300mm fabs are scheduled.

According to Gerhard Ruppik, General Manager of Vistec Semiconductor Systems, "The Vistec LDS3300 C orders reflect a growing need of 70 and 45nm fabs to re-evaluate their macro defect inspection strategy".

"What has finally convinced our customer to choose us as their first choice provider is the system modularity offering automated defect inspection for the entire wafer surface including frontside, backside and edge/bevel/apex as well as the integrated review capability offering high optical performance in the UV and Deep UV mode".

"Beside the various technical advantages, the manufacturer's responsible engineers highly appreciate the superb application and service support offered by Vistec Semiconductor Systems".

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