Product category:
IC and Hybrid Processing Equipment
News Release from: Vistec Electron Beam | Subject: SB3050
Edited by the Electronicstalk Editorial
Team on 10 April 2006
E-beam system prepares for 32nm
technology
A high-performance variable shaped electron beam system enables direct patterning for the 32nm technology node for R and D and prototyping.
At last week's Semicon Europe 2006, Vistec Electron Beam released the new SB3050, a high-performance variable shaped beam (VSB) system that enables direct patterning for the 32nm technology node for R and D and prototyping This technology node will be introduced into production only in 2013
This article was originally published on Electronicstalk on 13 Jul 2006 at 8.00am (UK)
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Ready for the 32nm technology node
Vistec Electron Beam has two new orders in hand for advanced electron optical columns of the SB3050 variable shaped beam system.
Budget e-beam system enables a quick turn
A universal cost-effective e-beam system for both direct write and mask making applications enables users to react flexibly to market demands.
Electron beam system has dual use
The industry proven SB351 can be used for mask writing as well as direct write applications.
"We offer our customers the system for tomorrow's technology generation - today", explains Vistec Electron Beam General Manager Dr Sebastian Toelg.
"This enables the development of new process technologies and devices today to meet ITRS roadmap milestones in the future".
The SB3050 is a convincing concept: the first system was already sold prior to the official launch at Semicon.
Thanks to an improved electron optical column, it's possible to support structures for the 32nm technology node.
The architecture of the VSB system enables high precision direct write patterning (1nm writing grid) and high throughput.
With a 310 x 310mm2 stage travel range, this proven system offers full 300mm writing capabilities for wafers, masks and templates (for nano-imprint applications).
State-of-the-art substrate handling meets all demands of the advanced resist technologies used by the semiconductor industry.
The SB3050 has a new production-compatible graphical user interface (GUI) and can be easily integrated into automated production environments (CIM).
wafer mix and match with optical lithography is supported by production compatible correction methods.
High-speed data processing - including proximity effect correction - is assured with a "cluster computer" using the latest dual core technology (up to 42 CPUs).
The proven combination of the "write on the fly" writing mode and the flexible stage speed (FSS) principle increases throughput - an essential parameter for low volume production, for fast prototyping, design evaluation and advanced R and D applications.
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