Ready for the 32nm technology node

Vistec Electron Beam has two new orders in hand for advanced electron optical columns of the SB3050 variable shaped beam system.

Vistec Electron Beam (previously Leica Microsystems Lithography ) has two new orders in hand for advanced electron optical columns of the SB3050 variable shaped beam system.

The launch of the new Vistec SB3050 at the Semicon Europe 2006 Show met with an enthusiastic response from the semiconductor industry, thanks to its high performance Variable Shaped Beam (VSB) capability that enables direct patterning for the 32nm technology node for RandD and prototyping.

The new electron optical column allows writing of 32nm structures (and smaller).

In particular, structures - down to 16nm wide - were written in high-resolution resists.

This level of performance convinced IMS Chips in Stuttgart, Germany and the Fraunhofer Center Nanoelectronic Technologies (CNT) in Dresden, Germany.

Both institutes are using SB300 series tools and upgrade their existing systems to the new column, which will be installed by Vistec within this year.

IMS Chips will use the new high-resolution column for electron beam direct writing, mask making and for template manufacturing required for NanoImprint applications.

CNT will use the electron beam direct write capability mainly to develop innovative memory chip processes and designs.

"Upgrading their systems with the new SB3050 column enables our customers to be ahead in a dynamic market with the resulting 32nm technology node capability," explains Dr Sebastian Tolg, Vistec Electron Beam General Manager.

"This is the only way to consistently improve the technologies and integrated circuits and to keep pace with the ITRS roadmap." Vistec Electron Beam customers can jump a technology generation at least with the SB3050 VSB system - today.

In addition to the improved, higher performance column, the proven 300mm stage system offers a 310 x 310mm squared stage travel range and full 300mm wafer-writing capabilities.

Specialized substrate handling meets the current resist technology demands in the semiconductor industry.

The SB3050 is a fully production compatible system.

The Graphical User Interface (GUI) and monitoring software can be easily integrated into automated semiconductor production environments (CIM).

The sophisticated recognition and correction methods assure compatibility between electron beam direct writing and optical lithography (Wafer Mix and Match).

High-speed data processing, including proximity effect correction is accomplished with a cluster computer (with up to 42 CPUs) using the latest dual core technology.

The proven combination of the "write-on-the-fly" writing mode and the Flexible Stage Speed (FSS) principle increases throughput - an essential parameter for low volume production, for fast prototyping, design evaluation and advanced RandD applications.

Back to top