Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: Vimicro International Corporation | Subject: Vinno-III (VC0818) application processor
Edited by the Electronicstalk Editorial
Team on 12 February 2008
Application processor boosts mobile
multimedia
Vinno-III-Win has a QVGA touch screen, a 3Mpixel camera, MPEG4/H.263 video, WMA and MP3 playback and recording, Bluetooth and an FM radio.
Vimicro has released the Vinno-III (VC0818) application processor and the Vinno-III-Win open mobile platform, based on Microsoft Windows Mobile operating system The new application processor and open mobile platform provide a lower cost option for smart phones
This article was originally published on Electronicstalk on 16 Apr 2007 at 8.00am (UK)
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Raymond Zhang, Senior Vice President of Vimicro said "Vinno-III offers customers not only a powerful SOC (System-on-Chip), but also a flexible development platform".
"Handset makers can fully use the Vinno-III-based platform to complete their creative design ideas and make diversified mobile phones".
Samuel Shen, Senior Director of the Strategic Partnership Group of Microsoft China Research and Development Group said, "Microsoft and Vimicro's efforts have had a positive impact on the PC multimedia market since our partnership began in 2002".
"In May 2007, we expanded the scope of our collaborations with Vimicro to encompass the mobile multimedia sector".
"We are pleased to see Vimicro's significant progress on the development of Windows Mobile-based mobile platform".
Vinno-III is based on ARM926EJ with built-in multimedia features such as hardware MPEG4/H.263 codec, JPEG codec, multiformat audio decoder, stereo ADC/DAC, SD/MMC and SDIO interface, NAND flash interface, high-speed USB, 3Mpixel sensor interface and QVGA colour screen.
All of these features bring an enhanced multimedia experience to mobile phone users.
Vinno-III-Win has a QVGA touch screen, a 3Mpixel camera, MPEG4/H.263 video, WMA and MP3 playback and recording, Bluetooth and an FM radio.
Vinno-III-Win can be adopted to design both 2.5G and 3G smart phones.
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