Product category:
Memory Devices and Modules
News Release from: Virtium Technology | Subject: VLP and ULP DDR2 modules
Edited by the Electronicstalk Editorial
Team on 06 April 2007
Low-profile memory modules go up to
4Gbyte
Very-low and ultra-low profile memory modules offer DIMM heights of 0.7in, (1.78cm), compared with the JEDEC standard of 0.72in (1.83cm) and operate over the extended industrial temperature range.
Virtium Technology has announced its DDR2 very low profile (VLP) and DDR2 ultra low profile (ULP) blade memory modules for embedded computing applications Both types of memory modules are designed with significant enhancements to the JEDEC standard, including reduced module height and densities up to 4Gbyte
This article was originally published on Electronicstalk on 23 Oct 2006 at 8.00am (UK)
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DDR2 modules are made for telecomms boards
Virtium Technology has broadened its DDR2 and DDR2 ECC registered SO-DIMM product families designed for telecomms equipment manufacturers and evolving telecommunications applications.
Virtium's VLP memory modules now include DDR2 VLP SODIMM, VLP SO-RDIMM and VLP SO-CDIMM variants, and the DDR2 ULP modules now include ULP Mini-RDIMM, ULP RDIMM and ULP UDIMM form factors.
Virtium has enhanced the JEDEC VLP memory module standard by offering VLP SODIMMs at densities up to 4Gbyte.
Virtium's new ULP memory module series offers DIMM heights of 0.7in, (1.78cm), enhanced from the JEDEC standard of 0.72in (1.83cm) All Virtium's VLP and ULP memory modules are available in extended industrial temperature range, and are suitable for AdvancedTCA memory, AdvancedMC memory, MicroTCA memory, PicoTCA memory and AMC memory for blade applications and PICMG SBCs.
"Our enhanced standard VLP and ULP memory modules provide a significant edge for TODAY's embedded system designers", says Phan Hoang, Director of Research and Development, Virtium Technology "Lower height and higher density memory is a major advantage when designing for demanding and complex embedded applications".
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