Memory modules put more on server blades

Edited by the Electronicstalk editorial team May 1, 2007

Memory modules are designed with significant enhancements to the JEDEC standard, including registered functionality, reduced module height, advanced cooling features and densities up to 4Gbyte.

Virtium Technology has released its DDR2 Very Low Profile (VLP) and DDR2 Ultra Low Profile (ULP) blade memory modules for blade server systems.

Both types of memory modules are designed with significant enhancements to the JEDEC standard, including registered functionality, reduced module height, advanced cooling features and densities up to 4Gbyte.

Virtium's VLP memory modules now include DDR2 VLP SODIMM, VLP SO-RDIMM and VLP SO-CDIMM.

Virtium's DDR2 ULP memory modules now include ULP Mini-RDIMM, RDIMM and VLP UDIMM, ULP RDIMM and ULP UDIMM form factors.

Virtium has enhanced the JEDEC VLP memory module standard by offering VLP SODIMMs at densities up to 1Gbyte.

Virtium's new ULP memory module series offers DIMM heights of 17.8mm, enhanced from the JEDEC standard of 18.3mm.

All Virtium's VLP and ULP memory modules are available in industrial temperature extended temperature range - solving thermal issues critical to proper blade server performance - and are ideal as AdvancedTCA memory (ATCA memory), AdvancedMC memory, MicroTCA memory, PicoTCA memory and AMC memory for blade applications and PICMG SBCs.

"Our enhanced standard VLP and ULP memory modules provide a significant edge for designers of high-performance blade server systems", said Phan Hoang, Director of Research and Development, Virtium Technology.

"Higher densities along with registered functionality and advanced cooling features offer a major advantage when designing for demanding and complex server blade environments".