Product category:
Memory Devices and Modules
News Release from: Virtium Technology | Subject: VLP DDR3 ECC SODIMMs
Edited by the Electronicstalk Editorial
Team on 26 September 2007
Third-generation modules save embedded
space
Memory modules are designed for space constrained next-generation AdvancedTCA, AdvancedMC, MicroTCA, PicoTCA, PC104, SBB canisters and PICMG SBCs.
Virtium Technology has a new family of small-form-factor very-low-profile ECC memory modules for embedded systems The new VLP DDR3 ECC SODIMMs are designed for space constrained next-generation AdvancedTCA, AdvancedMC, MicroTCA, PicoTCA, PC104, SBB canisters and PICMG SBCs
This article was originally published on Electronicstalk on 23 Oct 2006 at 8.00am (UK)
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Virtium Technology has broadened its DDR2 and DDR2 ECC registered SO-DIMM product families designed for telecomms equipment manufacturers and evolving telecommunications applications.
Low-profile memory modules go up to 4Gbyte
Very-low and ultra-low profile memory modules offer DIMM heights of 0.7in, (1.78cm), compared with the JEDEC standard of 0.72in (1.83cm) and operate over the extended industrial temperature range.
Virtium VLP DDR3 SODIMM ECC memory modules are designed with significant enhancements to the JEDEC standard, including ECC SODIMM error correction, registered ECC SODIMM functionality for the VLP SORDIMM and reduced module height of 18.3mm, enhanced from the JEDEC standard of 30mm.
All Virtium DDR3 ECC SODIMM memory modules are available with optional SODIMM heat spreader, industrial temperature extended temperature range DRAM, or thermal sensors to improve thermal performance in demanding environments or for small compact chassis with limited internal space and minimal airflow.
The new DDR3 SODIMM memory modules operate at a lower voltage to deliver data bandwidths up to12,800Mbyte/s and use less power when compared with DDR2.
DDR3 also provides larger prefetch for faster data access by the processor with improved noise suppression and signal integrity using DDR3 differential data strobing, dynamic I/O signal termination and on-die dynamic termination (ODT) "The embedded computing industry demands highly reliable ruggedised memory solutions that push the envelope for small form factors while maintaining above average thermal characteristics", says Phan Hoang, Director of Research and Development, Virtium Technology.
"Our release of the new DDR3 ECC SODIMM, combined with new DDR3 ECC chipsets, is the next step in the evolution of DRAM technology to deliver cutting-edge memory solutions for embedded computing applications".
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