Product category:
PCB Assembly Equipment and Tools
News Release from: VJ Electronix
Edited by the Electronicstalk Editorial
Team on 06 September 2006
Rework system characterisation explained
Al Cabral will present during the "Lead-free rework basics" session of the SMTA International Conference, scheduled to take place at the Assembly Technology Expo in Chicago.
Al Cabral from VJ Electronix will present during the "Lead-free rework basics" session of the SMTA International Conference, scheduled to take place at the Assembly Technology Expo in Rosemont, Chicago, USA Cabral will present on "Rework system-to-system performance characterisation" on Wednesday 27th September 2006 during the 1530 to 1700 session in Room 6
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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He will describe a practical approach to characterising the thermal performance of similarly configured rework systems with the aim of yielding like thermal performance.
Using simple methods developed to gauge the performance of various rework systems with proven measurement techniques, results can be easily analysed to provide improved system-to-system performance, be they within the same building or across the globe.
Lead-free assembly is here today and is creating many rework challenges.
Eliminating lead from electronics assemblies can and does adversely effect cycle time, scrap rate, reliability and, ultimately, rework costs.
Lead-free rework basics bring the answers you are looking for beginning with hand soldering touch-up and ECOs progressing through component replacement.
Through this session delegates will gain insight and timely information needed to streamline their repair centres for the coming wave of lead-free rework and repair.
The session will be chaired by Steve Stach of Austin American Technology Corp and co-chaired by Emmanuel (Manno) Simeus of Raytheon Missile Systems.
Other presenters during this session include Mark Cannon, Ersa; Bob Klenke and Phil Zarrow, ITM Consulting; and David Geiger, Damone Phanavong and Dongkai Shangguan, PhD of Flextronics International USA.
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