Product category:
Discrete Power Devices
News Release from: Vishay Siliconix
Edited by the Electronicstalk Editorial
Team on 14 March 2005
STMicroelectronics signs for packaging
technology
STMicroelectronics is to license a new power MOSFET packaging technology that provides superior thermal performance via top and bottom heat dissipation paths in systems using forced air cooling.
STMicroelectronics and Siliconix have concluded an agreement whereby ST will license from Siliconix a new power MOSFET packaging technology that provides superior thermal performance via top and bottom heat dissipation paths in systems using forced air cooling Offered by Siliconix under the PolarPAK name, the new package's leadframe and plastic encapsulation are similar to those used for most standard power MOSFET packages, ensuring good die protection and easy handling in manufacturing
This article was originally published on Electronicstalk on 13 Dec 2005 at 8.00am (UK)
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Novel package cools MOSFETs both ways
The novel PolarPAK package uses double-sided cooling to reduce thermal resistance, package resistance and package inductance for a more efficient, faster-switching power MOSFET.
N-channel MOSFETs feature double-sided cooling
N-channel 20, 30 and 40V PolarPAK MOSFETs with double-sided cooling give designers a new way to reduce system size and cost through better MOSFET thermal performance.
Yet compared with the standard SO-8, the PolarPAK package dissipates heat so efficiently that it can handle twice the current within the same footprint dimensions.
"With the size of DC-to-DC convertors continuing to shrink, it has become a challenge to dissipate the heat generated by various components on the PCB", said Ian Wilson, Manager of the Power MOSFET Division, STMicroelectronics.
"Advances in packaging need to be developed in tandem with silicon technology improvements".
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"The PolarPAK package, with its superior thermal handling capability, represents a remarkable evolution in assembly technology, allowing designers to increase efficiency and power density".
"This package technology will complement ST's range of STripFET MOSFETs optimised for power conversion in computer, datacom and telecom applications".
"By working together with Siliconix we will achieve the greater market acceptance of this new package necessary to enable cost-effective solutions", said Carmelo Papa, Corporate Vice President and General Manager of the Microcontroller, Linear and Discretes Product Group, STMicroelectronics.
"We are strongly committed to the computer and telecom segments, where we want to be an important player through continuous innovation".
"Siliconix power MOSFET innovations include the industry's first trench power MOSFETs and a wide range of package types that maximise power density and thermal performance", said Dr Felix Zandman, Vishay Chairman and Chief Technical and Business Development Officer, and Dr Gerald Paul, Vishay President and CEO.
"PolarPAK is the latest in a long line of such technology milestones that have made Siliconix and Vishay industry leaders, and this new agreement with STMicroelectronics is a proud moment for us".
"In signing this agreement with STMicroelectronics, we are taking a significant step toward the adoption of PolarPAK as an industry-standard package by giving our customers the flexibility of being able to design with a multi-source solution", said Dr King Owyang, Siliconix President and CEO.
"We are proud to have a semiconductor industry leader such as ST recognise the benefits that PolarPAK can bring to a wide range of power MOSFET applications".
By delivering superior thermal performance and reducing package-related losses, the 5 x 6mm PolarPAK package allows designers to create smaller, more compact circuit designs with a lower component count.
With a height dimension of just 0.8mm, half the height of the SO-8, the PolarPAK package enables end products that are thinner as well.
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