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Substrate solves power LED thermal problems

A TT Electronics Welwyn Components product story
Edited by the Electronicstalk editorial team Apr 16, 2004

A novel aluminium-based substrate technology provides an optimum solution for thermal performance, yielding increased life expectancy and improved luminous densities for surface mount power LEDs.

With the increasing use of power LEDs in many new lighting applications TT electronics Welwyn Components has developed an aluminium-based substrate technology which provides the optimum solution for thermal performance, yielding increased life expectancy and improved luminous densities for surface mount power LEDs.

Welwyn and sister stateside company IRC, specifically developed the new robust technology, branded Anotherm, to resolve the issue of thermal power dissipation, which was preventing designers moving forward with high-intensity LED devices.

Anotherm is also seen as an ideal substrate solution for many applications where high component densities make semiconductor heat dissipation a major design challenge.

These include interior/exterior train and aircraft lighting, traffic and street signage and emergency vehicle lighting.

Anotherm is an intensified aluminium substrate technology, which, by utilising silk-screen printing, allows circuitry to be directly assembled onto the heatsink.

Overall construction negates the use of thermal grease, which stands as a major thermal barrier, and also cuts out additional manufacturing process steps.

John Graham, Marketing and Sales Director said: "To implement LED-based lighting solutions, the rapid transfer of localised heat from the LED is critical as heat build-up severely reduces the lifespan of the LED - typically the junction temperature must not exceed 125C.

To satisfy this, TT electronics present a highly thermal conductive substrate which minimises thermal impedance by up to 42% more than standard metal cored substrates".

Due to the varied nature of LED housing and associated environments, specific options are available on both irregular shaped substrates and extruded heatsinks.

Integration of the LED drive electronics is achievable with the in-house capability to lay crossover tracks down to 150uin track width.

Anotherm is also solder and conductive epoxy compatible.

Where direct chip attach and wire bond of LEDs is required, Welwyn offers a complete range of alternative substrate solutions including ceramic, insulated metal, steel and FR4.

In conjunction to providing substrates solutions, Welwyn offer circuit design services and full SMT assembly capabilities.

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