Product category:
Analogue and Mixed Signal ICs
News Release from: Wolfson Microelectronics | Subject: Lead-free packaging
Edited by the Electronicstalk Editorial
Team on 15 April 2004
Wolfson scraps lead from new products
Wolfson Microelectronics is to supply all its new products in lead-free format only, compatible both with conventional SnPb and Pb-free soldering processes.
Wolfson Microelectronics is to supply all new products in lead (Pb)-free format only, compatible both with conventional SnPb and Pb-free soldering processes, for easy integration into any PCB assembler's Pb-free roadmap Wolfson has successfully qualified the processes and materials for its emerging range of Pb-free devices, and is now ready to begin shipping
This article was originally published on Electronicstalk on 13 Apr 2001 at 8.00am (UK)
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"We are about to become an entirely Pb-free supplier", said Jim Reid, Chief Technical Officer for Wolfson Microelectronics.
Component leads will be plated with matt tin, which delivers high joint strength and reliability with traditional SnPb solders as well as the new generations of Pb-free alloys such as the SnAgCu family.
"We have proved the new Pb-free construction, and are now able to apply this technology to leaded components throughout the entire product range", explained Reid.
"We believe customers can therefore expect consistent, repeatable soldering performance from each component we bring to market".
Matt tin plating benefits from compositional stability, good wetting and solderability properties, and low dendritic growth.
These are fundamental requirements of a plating treatment for component leads.
At 230C, the melting temperature is higher than for traditional SnPb alloys.
However, its wetting performance allows traditional SnPb solders to form a strong electrical and mechanical bond by atomic redistribution, at the normal SnPb reflow temperature.
As a result, PCB assemblers using SnPb alloys do not need to make significant changes to assembly processes or the reflow profile.
Matt tin is also a cost-effective plating solution that can be integrated into the component packaging process at little cost.
For PCB assemblers using Pb-free solder pastes, which require a higher solder paste melting temperature, Wolfson's Pb-free packages have been qualified to be robust for solder reflow profiles using a peak temperature of 260C.
The company is also developing Pb-free BGA packages for forthcoming product introductions.
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