Product category:
Analogue and Mixed Signal ICs
News Release from: Xemics | Subject: XE3005
Edited by the Electronicstalk Editorial
Team on 16 June 2003
Codec shrinks to chip-scale packaging
The XE3005 low-power codec is now available in an Ultra CSP chip-scale package.
The XE3005 low-power codec is now available in an Ultra CSP chip-scale package The Ultra CSP is a true wafer level packaging technology using standard equipment to produce a thin-film, solderable redistribution layer
This article was originally published on Electronicstalk on 19 Dec 2001 at 8.00am (UK)
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Due to the almost die-sized form factor, Xemics customers are now able to integrate a complete 16bit codec on about 8mm2 of PCB space.
The device can be assembled using a standard surface mount process which significantly eases volume production compared with dies or flip chips.
"Our customers working on miniaturised consumer products will significantly benefit from this cost effective packaging technology by not adding any size or cost penalty due to the packaging process", said Remy Pache, VP Marketing of Xemics.
He added that: "This very competitive size, performance and price-wise device will pave the usage of advanced packaging technologies for other products within Xemics like our Bluetooth series".
The XE3000 series of devices operates down to 1.8V, consumes less than 600uA during full operation and offers a full duplex PCM and SPI interface.
Besides independent TX and RX power save modes - Sandman function - several predefined operation modes can be used to further ease the usage and to benefit from the self initialisation and the fact that the SPI does not need to be connected to any controller.
Xemics reckons the XE3000 is the ideal codec device for many portable consumer products like Bluetooth headsets, cordless telephones, voice storage/playback and - thanks to a sampling frequency of up to 48kHz - even for voice recognition applications.
By combining the XE3005 with the Xemics Bluetooth solution, for example, a complete headset can be built consuming less than 22mW at 1.8V when used in an HV3 link.
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