Product category:
Wireless Communications
News Release from: Xemics | Subject: DP1203
Edited by the Electronicstalk Editorial
Team on 08 December 2003
Ready-to-run RF modules drop in onboard
A new range of "drop-in" RF modules is designed to facilitate the development of wireless communication applications and to reduce the time to market.
A new range of "drop-in" RF modules is designed to facilitate the development of wireless communication applications and to reduce the time to market DP1203 modules can be soldered directly onto a host board to add RF capabilities with ranges of up to several kilometres, through high output power and excellent sensitivity
This article was originally published on Electronicstalk on 19 Dec 2001 at 8.00am (UK)
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The 868MHz module is ETSI precertified and the 915MHz module is FCC precertified.
All critical high-frequency circuits are housed in a shielding can for extra protection against shock and EMI.
No external components (apart from an antenna) are required.
The module incorporates an onboard antenna matching circuit, making integration straightforward, even for engineers with no previous RF experience.
The DP1203 868 and 915MHz modules can be soldered directly onto the main system board just like other components.
The modules are suited for automated assembly systems for high volume production, which significantly reduces the cost of manufacture.
The DP1203 offers the unique advantage of high-datarate communication up to 152.3kbit/s.
Offering high output power and exceptional receiver sensitivity, the 868MHz radio module is suitable for applications conforming to the European (ETSI EN300-220-1 and EN301 489-3) regulatory standards whereas the 915MHz module conforms to FCC Part 15 applicable in the USA.
The DP1203 is the perfect module for complex wireless networks; high datarate applications, voice-over-RF, and applications where small size and extremely short time to market are high priorities.
With an 18 x 30mm footprint, the DP1203 module fits perfectly into most customers' applications.
Based on surface mount technology with components mounted only on one side, this module offers the advantage of being both very small and inexpensive.
No additional interface circuitry is required between the drop-in module and the microcontroller.
The modules are priced at below $10.00 in volume.
Samples are available ex-stock direct from Xemics and will be deliverable in volume from mid-February 2004.
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